Abstract: The present invention brings an actual concentration of a process gas closer to an ideal concentration, and a gas analysis device that is used in a fluid control system that controls a process gas obtained by vaporizing a liquid material or a solid material, the gas analysis device including: a first concentration calculation unit that calculates a concentration of the process gas; a second concentration calculation unit that calculates a concentration of a by-product gas at least generated in a side reaction that is a reaction different from a main reaction for generating the process gas; a comparison unit that compares a first actual concentration that is the concentration of the process gas calculated by the first concentration calculation unit with a first ideal concentration, and compares a second actual concentration that is the concentration of the by-product gas calculated by the second concentration calculation unit with a second ideal concentration.

Abstract: The present invention is aimed to perform precise monitoring of the processed amount by which a workpiece is processed, and includes a measurement unit that measures a concentration or a partial pressure of a reaction product generated while the workpiece is being processed, and an operation unit that calculates the processed amount of the workpiece using an output value of the measurement unit. The measurement unit includes: a laser light source that irradiates target gas containing the reaction product with a laser beam; a photodetector that detects a laser beam having passed through the target gas; and a signal processing unit that calculates the concentration or the partial pressure of the reaction product based on a detection signal of the photodetector. The operation unit includes a time integration unit; a relationship data storage unit; and a processed amount calculation unit.

Abstract: The present invention is a gas analysis device that measures a concentration or partial pressure of a halide contained in a material gas used in semiconductor manufacturing process or a by-product gas generated in semiconductor manufacturing process with good accuracy, the device being for analyzing a concentration or partial pressure of a halide contained in a material gas used in a semiconductor manufacturing process or a by-product gas generated in a semiconductor manufacturing process, the device including a gas cell into which the material gas or the by-product gas is introduced, a laser light source that irradiates the gas cell with laser light whose wavelength is modulated, a light detector that detects the laser light transmitted through the gas cell, and a signal processing unit that calculates the concentration or partial pressure of the halide by using a light absorption signal obtained from an output signal of the light detector.

Abstract: Provided are a gas cell into which a gas is introduced, a temperature control block configured to control a temperature of the gas cell, and a pressure sensor configured to measure a pressure inside the gas cell. The pressure sensor is built into the temperature control block and/or the gas cell.

Abstract: In order to enable concentrations of components to be measured to be accurately calculated even when higher boiling compounds are contained in a test gas, a gas analysis device that analyzes components to be measured that are contained in a test gas using a light spectrum obtained by irradiating light onto the test gas is provided with a calibration curve data storage section in which is stored first calibration curve data in which effects on concentrations of the components to be measured from higher boiling compounds whose boiling point is higher than a heating temperature of an analyzer into which the test gas has been introduced have been corrected, and with a concentration calculation section that calculates concentrations of components to be measured using the first calibration curve data.

Abstract: A gas analysis apparatus includes a calibration curve data storage section designed to store N types of calibration curve data which are previously created for N types of measurement target components and obtained by correcting influences of other N?1 types of measurement target components with respect to a concentration of each of the measurement target components, and a concentration calculation section designed to calculate a concentration of each of the measurement target components by using the N types of calibration curve data. When there exists a subthreshold component whose concentration calculated by the concentration calculation section is not more than a predetermined threshold value, the concentration calculation section calculates a concentration of each of the measurement target components other than the subthreshold component by using calibration curve data obtained without correcting an influence of the subthreshold component.

Abstract: In order to enable concentrations of components to be measured to be accurately calculated even when higher boiling compounds are contained in a test gas, a gas analysis device that analyzes components to be measured that are contained in a test gas using a light spectrum obtained by irradiating light onto the test gas is provided with a calibration curve data storage section in which is stored first calibration curve data in which effects on concentrations of the components to be measured from higher boiling compounds whose boiling point is higher than a heating temperature of an analyzer into which the test gas has been introduced have been corrected, and with a concentration calculation section that calculates concentrations of components to be measured using the first calibration curve data.

Abstract: A gas analysis apparatus includes a calibration curve data storage section designed to store N types of calibration curve data which are previously created for N types of measurement target components and obtained by correcting influences of other N-1 types of measurement target components with respect to a concentration of each of the measurement target components, and a concentration calculation section designed to calculate a concentration of each of the measurement target components by using the N types of calibration curve data. When there exists a subthreshold component whose concentration calculated by the concentration calculation section is not more than a predetermined threshold value, the concentration calculation section calculates a concentration of each of the measurement target components other than the subthreshold component by using calibration curve data obtained without correcting an influence of the subthreshold component.

Abstract: A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole in the resin sheet and inserting the punched conductive metal chip in the through hole of the resin sheet whereby the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet, and if a large number of such substrates are laminated, electrical connection in the thickness direction can readily be made by virtue of the protruded conductive metal chips and a multi-layer board can be readily produced.

Abstract: A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole in the resin sheet and inserting the punched conductive metal chip in the through hole of the resin sheet whereby the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet, and if a large number of such substrates are laminated, electrical connection in the thickness direction can readily be made by virtue of the protruded conductive metal chips and a multi-layer board can be readily produced.