Patents by Inventor Motonori KINO

Motonori KINO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11296008
    Abstract: An aluminum-silicon carbide composite including flat-plate-shaped composited portion containing silicon carbide and an aluminum alloy, and aluminum layers containing an aluminum alloy provided on both plate surfaces of composited portion, wherein circuit board is mounted on one plate surface and the other plate surface is used as heat-dissipating surface, wherein: the heat-dissipating-surface-side plate surface of the composited portion has a convex curved shape; the heat-dissipating-surface-side aluminum layer has a convex curved shape; ratio (Ax/B) between the average (Ax) of the thicknesses at the centers on opposing short sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.91?Ax/B?1.00; and a ratio (Ay/B) between the average (Ay) of the thicknesses at the centers on opposing long sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.94?Ay/B?1.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: April 5, 2022
    Assignee: DENKA COMPANY LIMITED
    Inventors: Takeshi Miyakawa, Motonori Kino, Hideki Hirotsuru
  • Patent number: 10869413
    Abstract: A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.
    Type: Grant
    Filed: July 3, 2015
    Date of Patent: December 15, 2020
    Assignee: DENKA COMPANY LIMITED
    Inventors: Takeshi Miyakawa, Motonori Kino
  • Patent number: 10669476
    Abstract: The purpose of the present invention is to provide a potassium fluoromanganate for use as a raw material for a manganese-activated complex fluoride phosphor, from which a manganese-activated complex fluoride phosphor having good fluorescence properties and reliability can be produced. The potassium fluoromanganate of the present invention is characterized in that, in an orbital electron binding energy spectrum diagram for manganese obtained by X-ray photoelectron spectroscopy, a ratio (signal intensity value A/signal intensity value B) between a signal intensity value A obtained by subtracting a background value from a maximum signal intensity value for binding energy values within the range from 643.0 eV or more to 644.0 eV or less, and a signal intensity value B obtained by subtracting the background value from a maximum signal intensity value for binding energy values within the range from 645.0 eV or more to 646.0 eV or less, is greater than 0 and no greater than 0.9.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: June 2, 2020
    Assignee: DENKO COMPANY LIMITED
    Inventors: Hideyuki Emoto, Motonori Kino, Masayoshi Ichikawa
  • Publication number: 20180094188
    Abstract: The purpose of the present invention is to provide a potassium fluoromanganate for use as a raw material for a manganese-activated complex fluoride phosphor, from which a manganese-activated complex fluoride phosphor having good fluorescence properties and reliability can be produced. The potassium fluoromanganate of the present invention is characterized in that, in an orbital electron binding energy spectrum diagram for manganese obtained by X-ray photoelectron spectroscopy, a ratio (signal intensity value A/signal intensity value B) between a signal intensity value A obtained by subtracting a background value from a maximum signal intensity value for binding energy values within the range from 643.0 eV or more to 644.0 eV or less, and a signal intensity value B obtained by subtracting the background value from a maximum signal intensity value for binding energy values within the range from 645.0 eV or more to 646.0 eV or less, is greater than 0 and no greater than 0.9.
    Type: Application
    Filed: September 29, 2017
    Publication date: April 5, 2018
    Inventors: Hideyuki Emoto, Motonori Kino, Masayoshi Ichikawa
  • Publication number: 20170236767
    Abstract: An aluminum-silicon carbide composite including flat-plate-shaped composited portion containing silicon carbide and an aluminum alloy, and aluminum layers containing an aluminum alloy provided on both plate surfaces of composited portion, wherein circuit board is mounted on one plate surface and the other plate surface is used as heat-dissipating surface, wherein: the heat-dissipating-surface-side plate surface of the composited portion has a convex curved shape; the heat-dissipating-surface-side aluminum layer has a convex curved shape; ratio (Ax/B) between the average (Ax) of the thicknesses at the centers on opposing short sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.91?Ax/B?1.00; and a ratio (Ay/B) between the average (Ay) of the thicknesses at the centers on opposing long sides of outer peripheral surfaces and thickness (B) at central portions of the plate surfaces satisfies the relationship: 0.94?Ay/B?1.
    Type: Application
    Filed: July 29, 2015
    Publication date: August 17, 2017
    Applicant: DENKA COMPANY LIMITED
    Inventors: Takeshi MIYAKAWA, Motonori KINO, Hideki HIROTSURU
  • Publication number: 20170162469
    Abstract: [Problem] To inexpensively provide a heat dissipating component that has thermal conductivity, as well as a low specific gravity, and a coefficient of thermal expansion close to that of a ceramic substrate, and furthermore having warpage so as to be able to be joined with good closeness of contact to a heat dissipating component or the like. [Solution] A silicon carbide composite which is a plate-shaped composite formed by impregnation of a porous silicon carbide molded article by a metal having aluminum as a main component, wherein the amount of warpage with respect to 10 cm of length of the main surface of the composite is 250 ?m or less, and the amount of warpage of a power module using the plate-shaped composite is 250 ?m or less; and a heat dissipating component using the same.
    Type: Application
    Filed: February 2, 2015
    Publication date: June 8, 2017
    Applicant: DENKA COMPANY LIMITED
    Inventors: Motonori KINO, Hideki HIROTSURU, Takeshi MIYAKAWA
  • Publication number: 20170142859
    Abstract: A heat-dissipating component, and a method for manufacturing the same, the component provided with a composited portion including a plate-shaped molded body containing silicon carbide, and hole-formation portions formed in a peripheral edge portion of the composited portion; through-holes being formed in the hole formation sections; the hole-formation portions containing inorganic fibers; the molded body and the inorganic fibers being impregnated with an aluminum-containing metal; and the hole-formation portions forming a part of the outer peripheral surface of the heat-dissipating component.
    Type: Application
    Filed: July 3, 2015
    Publication date: May 18, 2017
    Applicant: DENKA COMPANY LIMITED
    Inventors: Takeshi MIYAKAWA, Motonori KINO
  • Publication number: 20170092560
    Abstract: A semiconductor package having, stacked in the following order, a heat dissipating member, a joining layer and an insulation member, wherein the heat dissipating member has an aluminum-diamond composite containing diamond grains and a metal containing aluminum; and the joining layer that joins the heat dissipating member and the insulation member is formed using a composite material having silver oxide fine particles or organic-coated silver fine particles having an average particle size of at least 1 nm and at most 100 ?m.
    Type: Application
    Filed: May 26, 2015
    Publication date: March 30, 2017
    Applicant: DENKA COMPANY LIMITED
    Inventors: Takeshi MIYAKAWA, Motonori KINO, Yosuke ISHIHARA