Abstract: A multicore ultrafine coaxial wire is formed by consolidating a plurality of ultrafine coaxial wires in a flat array. Each of the ultrafine coaxial wires has a center conductor, whose tip portion is exposed, an insulating layer, an outer conductor, and a covering. The harness has a grounding member that connects in common the outer conductors of the multicore ultrafine coaxial wire and an insulator frame that fixes the center conductors. End portions of an underside film and end portions of a topside film both of the insulator frame are provided with an alignment hole to align the center conductors with circuits on a substrate.

Abstract: A cyclic peptide compound of the following general formula (I): Wherein R1, R2 and R3 are defined in the description, or a salt thereof. The compound (I) is useful for the prophylactic and/or therapeutic treatment of hepatitis C.

Abstract: The invention offers an ultrafine-coaxial-wire harness that enables connectorless connection to a substrate in a narrow space while maintaining the reliability and speediness of the operation. A multicore ultrafine coaxial wire 10 is formed by consolidating a plurality of ultrafine coaxial wires 11 in a flat array. Each of the ultrafine coaxial wires 11 has a center conductor 12, whose tip portion is exposed, an insulating layer 13, an outer conductor 14, and a covering 15. The harness has (a) a grounding member 20 that connects in common the outer conductors 14 of the multicore ultrafine coaxial wire 10 and (b) an insulator frame 30 that fixes the center conductors 12. End portions 31y of an underside film 31 and end portions 32y of a topside film 32 both of the insulator frame 30 are provided with an alignment hole 36 to align the center conductors 12 with circuits on a substrate.

Abstract: A cyclic peptide compound of the following general formula (I): Wherein R1, R2 and R3 are defined in the description, or a salt thereof. The compound (I) is useful for the prophylactic and/or therapeutic treatment of hepatitis C.

Abstract: A method of manufacturing a laminated electronic component such as a laminated ceramic capacitor, for example, which includes the steps of preparing a ceramic sheet provided with orientation marks, punching the ceramic sheet on the basis of the positions of the orientation marks, and stacking such ceramic sheets on the basis of the positions of the orientation marks. The punching step and the stacking step, which require alignment, are carried out on the basis of the positions of the orientation marks, whereby the ceramic sheets are stacked with high accuracy of alignment in the laminated electronic component as obtained.