Abstract: A sub-fab area installation apparatus capable of reducing a power consumption used in manufacturing of semiconductors is disclosed. The sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of the semiconductor manufacturing equipment; a cooling unit configured to cool a first circulation liquid used in the processing chamber; a heating unit configured to heat a second circulation liquid used in the processing chamber; an abatement device configured to detoxify the processing gas discharged from the vacuum pump; and a cooling-liquid line configured to pass a cooling liquid therethrough. The cooling liquid is supplied from a cooling source. The cooling-liquid line includes: a first downstream line, a second downstream line, and a third downstream line configured to supply the cooling liquid that has passed through the abatement device, the vacuum pump, and the cooling unit to the heating unit.

Abstract: A sub-fab area installation apparatus includes: a vacuum pump configured to evacuate a processing gas from a processing chamber of the semiconductor manufacturing equipment; a cooling unit configured to cool a first circulation liquid used in the processing chamber; a heating unit configured to heat a second circulation liquid used in the processing chamber; and a cooling-liquid line configured to pass a cooling liquid therethrough. The cooling liquid is supplied from a cooling source. The cooling-liquid line includes: a distribution line configured to supply the cooling liquid to the vacuum pump and the cooling unit; and a merging return line configured to merge the cooling liquid that has passed through the vacuum pump and the cooling unit and return the cooling liquid to the cooling source.

Abstract: A multi-refrigeration-cycle apparatus capable of reducing an installation area for equipment installed in a sub-fab and capable of shortening a pipe for delivering a cooling medium to a semiconductor-device manufacturing equipment is disclosed. The multi-refrigeration-cycle apparatus includes: a first refrigeration cycle having a first refrigerant for performing heat exchange with a cooling medium for cooling the semiconductor-device manufacturing equipment, the first refrigerant circulating in the first refrigeration cycle; and a second refrigeration cycle having a second refrigerant for performing heat exchange with the first refrigerant, the second refrigerant circulating in the second refrigeration cycle. At least a part of the first refrigeration cycle is arranged in a clean room where the semiconductor-device manufacturing equipment is installed, and the second refrigeration cycle is arranged in a sub-fab.

Abstract: Prvided is a catalyst degradation preventing apparatus of a catalyst device containing a catalyst component that comes into contact with gas to chemically change the gas, including a burner for burning a fuel by combustible air to generate a gas containing nitrogen oxides by combustion, an endothermic device for absorbing heat from gas, a catalyst device having a catalyst component for decreasing nitrogen oxides contained in the gas after passing through the endothermic device, and a first poisoning substance removing device for removing a poisoning substance containing at least sulfur, which is contained in the fuel and adsorbs to a catalyst component or reacts with the catalyst component to form a compound. According to the apparatus, the decrease in performance of the catalyst device is prevented, and the effect of decreasing pollution can be retained over a long period of time.

Abstract: Provided is a catalyst degradation preventing apparatus, which is for a catalyst device containing a catalyst component that comes into contact with gas to chemically change the gas, in which the catalyst device is provided with a poisoning substance removing device on a primary side thereof, for removing a poisoning substance which is contained in the gas and adsorbs to the catalyst component or forms a compound with the catalyst component. Further, the poisoning substance removing device and the catalyst device are provided with an interval placed therebetween and to be exchangeable with each other, or a carrier of a component that adsorbs to the poisoning substance of the poisoning substance removing device or forms a compound with the poisoning substance and a carrier of a catalyst component of the catalyst device are integrally formed so as to be exchangeable.