Abstract: A semiconductor device having a seal member of insulative resin, tab suspension leads and leads exposed to the mounting surface of the seal member, a semiconductor element located in the seal member and fixed by an adhesive of the tab surface, and conductive wires for electrically connecting electrodes of the semiconductor element to the leads. At least a lead portion of the leads has an inverted trapezoid-like section configured of a upper surface embedded in the seal member, a lower surface exposed from the seal member, and side surfaces connecting the two side edges of the upper and lower surfaces. Two side edges of the upper surface are formed with machined surfaces, respectively, having one end connected to the upper surface and the other end connected to side surfaces. The machined surfaces are formed by the pressing process in different directions of extension with the upper and side surfaces.

Abstract: A highly reliable non-leaded semiconductor device having large terminal strength. A non-leaded semiconductor device having a seal member of insulative resin, tab suspension leads and leads exposed to the mounting surface of the seal member, a semiconductor element located in the seal member and fixed by an adhesive of the tab surface, and conductive wires for electrically connecting electrodes of the semiconductor element and leads to each other. At least a portion of the leads has an inverted trapezoid-like section configured of upper surface embedded in the seal member, lower surface opposed to the upper surface and exposed from the seal member, and side surfaces connecting the two side edges of the upper surface and the lower surface. The two side edges of the upper surface are formed with machined surfaces, respectively, having an end connected to upper surface and the other end connected to side surfaces.