Patents by Inventor Motoya Shimazu

Motoya Shimazu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tin or tin alloy electroplating solution
    Patent number: 9322106
    Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.
    Type: Grant
    Filed: May 18, 2013
    Date of Patent: April 26, 2016
    Inventors: Motoya Shimazu, Yasuo Ohta
  • TIN OR TIN ALLOY ELECTROPLATING SOLUTION
    Publication number: 20130270122
    Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.
    Type: Application
    Filed: May 18, 2013
    Publication date: October 17, 2013
    Inventors: Motoya SHIMAZU, Yasuo OHTA
  • Tin or tin alloy electroplating solution
    Patent number: 8466314
    Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.
    Type: Grant
    Filed: April 26, 2011
    Date of Patent: June 18, 2013
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Motoya Shimazu, Yasuo Ohta
  • TIN OR TIN ALLOY ELECTROPLATING SOLUTION
    Publication number: 20110259754
    Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.
    Type: Application
    Filed: April 26, 2011
    Publication date: October 27, 2011
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Motoya SHIMAZU, Yasuo Ohta
  • Tin or tin alloy electroplating solution
    Patent number: 7931793
    Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.
    Type: Grant
    Filed: April 24, 2008
    Date of Patent: April 26, 2011
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Motoya Shimazu, Yasuo Ohta
  • Electrolytic tin plating solution and electrolytic tin plating method
    Publication number: 20100000873
    Abstract: A plating solution and a plating method, which does not use a complexing agent and which provides favorable solder wetting properties and an extremely low coupling rate when electrolytic tin plating is performed, and particularly when electrolytic tin plating is performed using a barrel plating method.
    Type: Application
    Filed: June 11, 2009
    Publication date: January 7, 2010
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Masaaki Imanari, Fai Lung Ting, Motoya Shimazu, Yasuo Ohta
  • Tin or tin alloy electroplating solution
    Publication number: 20080283406
    Abstract: An additive obtained from the reaction product obtained by reacting glutaraldehyde and at least one type of compound selected from hydrocarbon compounds containing a hydroxyl group, and at least one type of compound selected from amine compounds, as well as a tin or tin alloy plating solution containing this additive.
    Type: Application
    Filed: April 24, 2008
    Publication date: November 20, 2008
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Motoya Shimazu, Yasuo Ohta
  • Nickel electroplating solution
    Patent number: 6858122
    Abstract: Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 4 to 9, and a ratio of nickel ions to chloride ions of 1 or less.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: February 22, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Makoto Kondo, Haruki Enomoto, Motoya Shimazu
  • Nickel electroplating solution
    Patent number: 6852211
    Abstract: Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 5 to 7, and a ratio of nickel ions to chloride ions of greater than 1.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: February 8, 2005
    Assignee: Shipley Company, L.L.C.
    Inventors: Makoto Kondo, Haruki Enomoto, Motoya Shimazu
  • Nickel electroplating solution
    Publication number: 20030213699
    Abstract: Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 5 to 7, and a ratio of nickel ions to chloride ions of greater than 1.
    Type: Application
    Filed: December 27, 2002
    Publication date: November 20, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Makoto Kondo, Haruki Enomoto, Motoya Shimazu
  • Nickel electroplating solution
    Publication number: 20030196906
    Abstract: Nickel plating baths that efficiently deposit layers of nickel on only the parts to be plated without corroding electronic parts that are ceramic composites or ceramic parts containing transition metal oxides are provided. Such nickel plating baths contain at least two chelating agents selected from amino polycarboxylic acids, polycarboxylic acids, and polyphosphonic acids, and have a pH in the range of 4 to 9, and a ratio of nickel ions to chloride ions of 1 or less.
    Type: Application
    Filed: December 27, 2002
    Publication date: October 23, 2003
    Applicant: Shipley Company, L.L.C.
    Inventors: Makoto Kondo, Haruki Enomoto, Motoya Shimazu