Abstract: A loudspeaker includes a frame, a diaphragm, an edge connecting portion, a magnetic circuit having a magnetic gap, and a voice coil body. The edge connecting portion connects an outer peripheral end portion of the diaphragm and the frame to each other. The diaphragm is disposed inside of the frame. The diaphragm has a planer diaphragm and a reinforcing diaphragm. Both a front surface and a rear surface of the planer diaphragm are flat. The reinforcing diaphragm includes a thick portion and a recessed portion, and is joined to the planer diaphragm. The reinforcing diaphragm is made of resin. The thick portion is formed on an outer periphery of the reinforcing diaphragm. The recessed portion is formed at a center side of the reinforcing diaphragm.

Abstract: A loudspeaker includes a frame, a diaphragm, an edge connecting portion, a magnetic circuit having a magnetic gap, and a voice coil body. The edge connecting portion connects an outer peripheral end portion of the diaphragm and the frame to each other. The diaphragm is disposed inside of the frame. The diaphragm has a planer diaphragm and a reinforcing diaphragm. Both a front surface and a rear surface of the planer diaphragm are flat. The reinforcing diaphragm includes a thick portion and a recessed portion, and is joined to the planer diaphragm. The reinforcing diaphragm is made of resin. The thick portion is formed on an outer periphery of the reinforcing diaphragm. The recessed portion is formed at a center side of the reinforcing diaphragm.

Abstract: In a method of manufacturing a high-frequency module, a resin substrate with a high frequency circuit including an electronic component mounted thereon is placed so that the electronic component faces a resin bath. A resin which is in a non-flowable state in the resin bath is softened until the resin becomes flowable, and air in space formed between the resin substrate and the resin is sucked. The resin substrate is brought into contact with a liquid surface of the resin. The resin is pressurized and allowed to flow into a gap between the resin substrate and the electronic component. The resin is cured so that a resin portion is formed on the resin substrate. A shield metal film is formed on a surface of the resin portion.

Abstract: In a method for manufacturing a module, a substrate is placed above a resin bath while a electronic component is directed downward. In addition, a resin thrown into the resin bath is softened until it becomes flowable. Then, a first surface of the substrate is brought into contact with a liquid surface of the softened resin. The softened resin is allowed to flow forcibly into a gap between the substrate and the electronic component. Then, the resin cures, and a resin portion is formed. Further, a metal thin film is formed on the surface of the resin portion by sputtering to form the shield metal film.

Abstract: A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.

Abstract: A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.

Abstract: The printed wiring board (PWB) includes (a) a fluid-resin embedding section formed at a location corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any air, and the reliable PWB is thus obtainable.

Abstract: A high frequency device includes an antenna connector adapted to be connected with an antenna, a board, a conductor layer provided on an upper surface of the board, a filter mounted on the upper surface of the board and connected with the antenna connector, and a high frequency circuit mounted on a lower surface of the board and connected with the filter. The filter includes a case having a hollow shape having an opening which opens downward, and a resonator accommodated in the case. The case has a lower end around the opening. The lower end of the case is joined to the conductor layer. The high frequency device has a small size.

Abstract: A radio-frequency signal receiver and its manufacturing method are disclosed. A tuner receives a radio-frequency signal, and a demodulator receives an output signal from the tuner. An error corrector receives an output from the demodulator. A determiner determines whether or not an error rate supplied from the error corrector is not less than a predetermined rate. A controller receives an output from the determiner, and based on the determination, the controller controls a plurality of sections forming the radio-frequency signal receiver. The controller controls selectively one of the plurality of sections, thereby lowering the error rate. A manufacturing method of this receiver makes a memory, coupled to the controller, store a shift-amount of frequency corresponding to an interference signal in a pass-band of a narrow-band filter.

Abstract: An antenna to be embedded in a capsule type medical device. The antenna includes an antenna conductor, and a sheet-like antenna substrate which at least partly electrically contacts with the antenna conductor. The antenna is formed by closely attaching the antenna conductor and the sheet-like antenna substrate.

Abstract: A level comparator supplied with oscillation signal of local oscillator for comparing the signal level of oscillation signal with a certain predetermined threshold value, and a driving section interposed between the output of level comparator and a control section are provided. When the level comparator recognized that the signal level exceeded the threshold value, it puts the driving section into operation for bringing the control section into action.

Abstract: A high frequency receiver capable of stably canceling interference by a transmission signal even if a transmission signal input from a TV antenna is changed. Phase shifter (212) for changing a phase of an interfering distributed transmission signal, detector (216) for detecting a level of a transmission signal included in a receive signal input via an antenna, and level regulator (213) for changing a level of the distributed transmission signal in accordance with this level are provided. A signal input via level regulator (213) and phase shifter (212) and a receive signal are synthesized to be input into mixer (206). Since a transmission signal can be cancelled even if a transmission signal input from an antenna is changed, a high frequency receiver can receive a signal stably when a transmission signal is changed.

Abstract: A multilayer module includes a parts-containing module whose circuit board has been mounted at one surface with an electronic component and the electronic component is covered with a resin layer. Connection terminals are provided either at the resin layer or at the other surface of the circuit board, and a through hole is provided for connection between the two surfaces of the module. Also included is a module, which is provided with connection terminals at a place corresponding to the connection terminal, and the through hole for connection between the connection terminals and electronic component. An insulation layer is disposed between conductor layers, the insulation layer having a conductive bond for connection between connection terminals, respectively. Locations of a through hole and an electronic component in the module are not restricted by a location of the through hole.

Abstract: A module includes a board having a through-hole provided therein, an auxiliary board provided on a lower surface of the board, a first electronic component mounted on an upper surface of the board, a conductive cover covering the first electronic component, and a second electronic component mounted on an upper surface of the auxiliary board. The auxiliary board includes a sealing portion sealing the through-hole. The second electronic component is positioned in the through-hole provided in the board and on the upper surface of the auxiliary board. The second electronic component is taller than the first electronic component. This module is thin.

Abstract: A high frequency receiver capable of stably canceling interference by a transmission signal even if a transmission signal input from a TV antenna is changed. Phase shifter (212) for changing a phase of an interfering distributed transmission signal, detector (216) for detecting a level of a transmission signal included in a receive signal input via an antenna, and level regulator (213) for changing a level of the distributed transmission signal in accordance with this level are provided. A signal input via level regulator (213) and phase shifter (212) and a receive signal are synthesized to be input into mixer (206). Since a transmission signal can be cancelled even if a transmission signal input from an antenna is changed, a high frequency receiver can receive a signal stably when a transmission signal is changed.

Abstract: A level comparator supplied with oscillation signal of local oscillator for comparing the signal level of oscillation signal with a certain predetermined threshold value, and a driving section interposed between the output of level comparator and a control section are provided. When the level comparator recognized that the signal level exceeded the threshold value, it puts the driving section into operation for bringing the control section into action.

Abstract: A multilayer module which includes parts-containing module whose circuit board has been mounted at one surface with electronic component and the electronic component is covered with resin layer. Connection terminals have been provided either at resin layer or at the other surface of circuit board, also through hole has been provided for connection between the two surfaces of module. Also included is module, which has been provided with connection terminals at a place corresponding to connection terminal, and through hole for connection between the connection terminals and electronic component. Disposed between conductor layer and conductor layer is insulation layer, which insulation layer having conductive bond for connection between connection terminals, respectively. In the above-described configuration, places of through hole and electronic component in module are not restricted by a location of through hole.

Abstract: A component-embedded printed wiring board (PWB) is disclosed. This PWB includes (a) a fluid-resin embedding section formed at place corresponding to electronic components such that the embedding section covers the electronic components, (b) a resin flow-speed accelerator placed in parallel with a top face of a circuit board and surrounding the embedding section, and (c) bonding resin placed at least between the accelerator and the circuit board. The fluid resin embedding section is filled up with the same resin as the bonding resin. This structure allows the accelerator to compress the resin with a pressure applied to the PWB, so that the resin tends to flow along the circuit board. As a result, the fluid-resin embedding section is thoroughly filled up with the resin without leaving any airs, and the reliable PWB is thus obtainable.

Abstract: A portable power amplifier includes portable encapsulating cases, a printed board incorporated in those encapsulating cases, and a power amplifying device mounted on this printed board. An antenna switch and an antenna are provided near the power amplifying device, which is connected to those components in a pattern. This structure improves heat dissipation efficiency of the portable power amplifier.

Abstract: The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range, and is cured in third temperature range, and integrating process (118) includes softening (120) of heating prepreg (141) to second temperature range, and softening the resin impregnated in prepreg (141), forced flowing (122) of compressing prepreg (141) before prepreg (141) comes to third temperature range, and forcing the resin to flow into space and gap formed among semiconductor (105), resistor (106), and substrate (101), and hardening (123) of heating prepreg (141) to third temperature range. As a result, without using intermediate material, space and gap formed among semiconductor (105), resistor (106), and substrate (101) can be securely filled with resin.