Abstract: A magnesium alloy structural member includes an alloy substrate that includes a sheet-shaped portion consisting of a magnesium alloy corresponding to an AZ91 alloy under the standards of American Society for Testing and Materials. The alloy substrate has a surface, a part of which is a mirror-finished portion having a surface roughness Ra of less than 0.3 ?m.

Abstract: A composite member includes a metal sheet having a bent portion formed by bending, and a resin member joined to at least a part of the bent portion. The metal sheet includes an opening provided on an inner side of the bent portion, and a tapered recess that tapers off from an outer side of the bent portion toward the opening. The resin member includes an inner resin part filled in the recess, and an exposed resin part provided to be continuous with the inner resin part and to extend to an inner surface of the bent portion through an edge portion of the opening.

Abstract: A composite member includes a metal sheet having a bent portion formed by bending, and a resin member joined to at least a part of the bent portion. The metal sheet includes an opening provided on an inner side of the bent portion, and a tapered recess that tapers off from an outer side of the bent portion toward the opening. The resin member includes an inner resin part filled in the recess, and an exposed resin part provided to be continuous with the inner resin part and to extend to an inner surface of the bent portion through an edge portion of the opening.

Abstract: This invention relates to a light-receiving module in which transmission impedance of lead terminals are matched by simple method. The module has a semiconductor light-receiving device, such as a photo diode, a plurality of lead terminals for transmitting an electrical signal converted by the semiconductor device, and a metal base with a plurality of through holes, the lead terminals passes therethrough. The diameter of the lead terminal for signal transmission is smaller as compared with that of other lead terminal and the diameter of the through holes is adjusted and filled by a sealant glass with a dielectric constant so as to match the impedance thereof.

Abstract: This invention relates to a light-receiving module in which transmission impedance of lead terminals are, matched by simple method. The module has a semiconductor light-receiving device, such as a photo diode, a plurality of lead terminals for transmitting an electrical signal converted by the semiconductor device, and a metal base with a plurality of through holes, the lead terminals passes therethrough. The diameter of the lead terminal for signal transmission is smaller as compared with that of other lead terminal and the diameter of the through holes is adjusted and filled by a sealant glass with a dielectric constant so as to match the impedance thereof.

Abstract: This invention relates to a light-receiving module in which transmission impedance of lead terminals are matched by simple method. The module has a semiconductor light-receiving device, such as a photo diode, a plurality of lead terminals for transmitting an electrical signal converted by the semiconductor device, and a metal base with a plurality of through holes, the lead terminals passes therethrough. The diameter of the lead terminal for signal transmission is smaller as compared with that of other lead terminal and the diameter of the through holes is adjusted and filled by a sealant glass with a dielectric constant so as to match the impedance thereof.

Abstract: The present invention provides a semiconductor package allowing a semiconductor chip to be operated accurately and with high stability over a long period by effectively transferring the heat generated during the operation of the semiconductor chip to a heat sink. A package for housing a semiconductor chip comprises a substrate 2 having on the upper surface thereof a mounting space where a semiconductor chip 1 is to be mounted, a frame 3 being provided so as to surround the mounting space on the upper surface of the substrate 2 and having a joint 3a for an input/output terminal 5 on the side, and an input/output terminal 5 connected to the joint 3a, wherein the substrate 2, or part of the substrate 2, or the substrate 2 and the frame 3, or part of the substrate and the frame is formed from a metal-diamond composite in which a matrix material having diamond particles joined via a metal carbide is infiltrated with a copper and/or silver or a metal-diamond sintered body composed of diamond particles and copper.

Abstract: The present invention provides an economical package for housing semiconductor chip that allows a semiconductor chip to operate normally and stably over long periods by efficiently transferring heat generated during the operation of the semiconductor chip to the package mount substrate.

Abstract: The width of a signal line 3 is made narrower at a part connected with a connector pin 1 than a signal line width that can match the connector characteristic impedance. Furthermore, the width of the signal line 3 is made narrower at the part connected with the connector pin 1 than the projection width of the connector pin diameter. The disclosed connection structure of a planer waveguide signal line can, when a high frequency signal is transmitted from a rod-shaped coaxial structure to the signal line, prevent the transmissivity deterioration caused by radiation of the signal or reflection of the signal back to the outgoing side at the part of the signal line connected with a connector pin. The connection structure can also minimize transmission loss due to assembling error made during assembling into a semiconductor package.

Abstract: This invention relates to a light-receiving module in which transmission impedance of lead terminals are matched by simple method. The module has a semiconductor light-receiving device, such as a photo diode, a plurality of lead terminals for transmitting an electrical signal converted by the semiconductor device, and a metal base with a plurality of through holes, the lead terminals passes therethrough.

Abstract: A sub-miniature push-on RF connector for connecting a transmission line to a signal sink. The connector has a shielded transmission line section having a signal line and a ground line extending axially through the connector. A center pin is coupled to the signal line and extends from the center of a front face of the connector in an axial direction. A semicircular tab coupled to the ground line extends from the front face of the connector substantially along the length of the center pin and partially surrounding the center pin to reduce an air gap impedance, the tab having first and second wire bonding surfaces at the ends of the semicircular shape thereof and disposed adjacent to said center pin.