Abstract: A cooling apparatus for a heat-generating element includes: a heat sink on which the heat-generating element is mounted; a cooling component having a recess, the cooling component and the heat sink being faced and joined to each other so that the recess forms a coolant passage; and a sealing member provided between the heat sink and the cooling component so as to seal the coolant passage and separate an interior and exterior of the coolant passage. A first distance is longer than a second distance with regard to a distance between facing surfaces of the heat sink and the cooling component near the sealing member, the first distance being between the facing surfaces at an interior side of the coolant passage separated by the sealing member, and the second distance is a distance between the facing surfaces at an exterior side of the coolant passage separated by the sealing member.

Abstract: A cooling apparatus for a heat-generating element includes: a heat sink on which the heat-generating element is mounted; a cooling component having a recess, the cooling component and the heat sink being faced and joined to each other so that the recess forms a coolant passage; and a sealing member provided between the heat sink and the cooling component so as to seal the coolant passage and separate an interior and exterior of the coolant passage. A first distance is longer than a second distance with regard to a distance between facing surfaces of the heat sink and the cooling component near the sealing member, the first distance being between the facing surfaces at an interior side of the coolant passage separated by the sealing member, and the second distance is a distance between the facing surfaces at an exterior side of the coolant passage separated by the sealing member.

Abstract: A semiconductor device includes an electric conduction portion having a flat plate shape, a semiconductor element being arranged vertically over the electric conduction portion and being electrically connected thereto, a casing whose lower portion of an inner wall has a coupling portion coupled with a circumferential edge portion of the electric conduction portion and whose upper portion of the inner wall surrounds the whole circumference of the electric conduction portion and a sealing material that vertically downwardly encapsulates the semiconductor element and the electric conduction portion. The electric conduction portion and the casing are integrally molded, and a space having a shape coupled to a circumferential edge portion of the electric conduction portion is provided in the lower portion of the inner wall of the casing as the coupling portion.

Abstract: A heat dissipation assembly in which a heat generator and a heat dissipator are integrated via an electrically insulating and thermally conductive sheet, at least one surface of which a thermally conductive grease is applied to, in which the thermally conductive grease is incompatible with the electrically insulating and thermally conductive sheet. Heat from the heat generator such as a semiconductor device or the like can be effectively dissipated while an electrically insulating condition is maintained over a long period of time.

Abstract: An insulation sheet is formed by a heat conductive filler of an amount of 70–93 mass % in an organopolysiloxane base material. The content of conductive impurities in the insulation sheet is 500 ppm or less. The insulation sheet according to one embodiment is interposed between a semiconductor device and a heat sink.

Abstract: A semiconductor device includes first and second semiconductor chips formed with electrodes on front and reverse sides, a first bus bar on which the first semiconductor chip is mounted so as the reverse side electrode to be connected thereto, a second bus bar, arranged parallel with the first bus bar, on which the second semiconductor chip is mounted so as the reverse side electrode to be connected thereto, a third bus bar that is press-connected to the front side electrode of the first semiconductor chip, a fourth bus bar that is press-connected to the front side electrode of the second semiconductor chip, and a connecting section that electrically connects the first bus bar and the fourth bus bar.

Abstract: A heat dissipation assembly in which a heat generator and a heat dissipator are integrated via an electrically insulating and thermally conductive sheet, at least one surface of which a thermally conductive grease is applied to, in which the thermally conductive grease is incompatible with the electrically insulating and thermally conductive sheet. Heat from the heat generator such as a semiconductor device or the like can be effectively dissipated while an electrically insulating condition is maintained over a long period of time.

Abstract: An insulation sheet is formed by a heat conductive filler of an amount of 70-93 mass % in an organopolysiloxane base material. The content of conductive impurities in the insulation sheet is 500 ppm or less. The insulation sheet according to one embodiment is interposed between a semiconductor device and a heat sink.