Patents by Inventor Motoyuki Itoh

Motoyuki Itoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11591179
    Abstract: A multi-core cable core aligning device is composed of a temporary holding mechanism, which is configured to arrange tips of a plurality of cores exposed at one end of a multi-core cable in a row along a predetermined arranging direction, and temporarily hold each one of the plurality of cores in such a manner as to be movable along the predetermined arranging direction, a transferring mechanism, which is configured to transfer the plurality of cores one by one while separating the plurality of cores held by the temporary holding mechanism one by one from other ones of the plurality of cores, and an aligning mechanism, which is configured to align and hold the plurality of cores with a predetermined space between adjacent ones of the plurality of cores while holding the plurality of cores transferred by the transferring mechanism one by one at spaced intervals.
    Type: Grant
    Filed: September 6, 2019
    Date of Patent: February 28, 2023
    Assignee: HITACHI METALS, LTD
    Inventors: Takahiro Kinoshita, Shinji Takane, Motoyuki Itoh
  • Publication number: 20200079612
    Abstract: A multi-core cable core aligning device is composed of a temporary holding mechanism, which is configured to arrange tips of a plurality of cores exposed at one end of a multi-core cable in a row along a predetermined arranging direction, and temporarily hold each one of the plurality of cores in such a manner as to be movable along the predetermined arranging direction, a transferring mechanism, which is configured to transfer the plurality of cores one by one while separating the plurality of cores held by the temporary holding mechanism one by one from other ones of the plurality of cores, and an aligning mechanism, which is configured to align and hold the plurality of cores with a predetermined space between adjacent ones of the plurality of cores while holding the plurality of cores transferred by the transferring mechanism one by one at spaced intervals.
    Type: Application
    Filed: September 6, 2019
    Publication date: March 12, 2020
    Inventors: Takahiro KINOSHITA, Shinji TAKANE, Motoyuki ITOH
  • Publication number: 20140366802
    Abstract: The gas nozzle comprises: an outer tube part that is provided in an upright position with respect to the liquid surface of molten metal; an inner tube part provided inside the outer tube part, comprising a cavity inside, through which a wire rod pulled up from the molten metal passes; a void part formed between the outer tube part and the inner tube part; a gas introduction part for introducing gas into the void part; and a jetting port for jetting at least part of the gas introduced by the gas introduction part, via the void part, from one end of the outer tube part towards the liquid surface of the molten metal.
    Type: Application
    Filed: November 26, 2012
    Publication date: December 18, 2014
    Inventors: Motoyuki Itoh, Kyoko Takeda
  • Patent number: 8622261
    Abstract: A molten metal supply cylinder for melting a low melting point metallic material in a solid phase and supplying the molten metal material, including a melting section to be directly or indirectly brought into contact with a low melting point metallic material to produce molten metal, and a substantially tubular flow path that has a first opening formed at an end thereof in the melting section and a second opening at the other end thereof and allows the molten metal produced in the melting section to flow. An oxide of the surface layer of the low melting point metallic material is removed by an oxide removing section before the low melting point metallic material is molten in the melting section.
    Type: Grant
    Filed: August 7, 2009
    Date of Patent: January 7, 2014
    Assignee: Hitachi Metals, Ltd.
    Inventors: Motoyuki Itoh, Kenichi Kubo
  • Publication number: 20110210483
    Abstract: An object of the present invention is to provide a molten metal supply cylinder that has a simple configuration if compared with the configurations of the prior art and can suppress mixing of oxide that is produced on the surface of a low melting point metallic material in a solid phase with molten metal.
    Type: Application
    Filed: August 7, 2009
    Publication date: September 1, 2011
    Applicant: Hitachi Metals, Ltd.
    Inventors: Motoyuki Itoh, Kenichi Kubo
  • Patent number: 7614541
    Abstract: An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned.
    Type: Grant
    Filed: August 25, 2008
    Date of Patent: November 10, 2009
    Assignee: Hitachi Metals, Ltd.
    Inventors: Motoyuki Itoh, Masanori Ochiai, Shinichi Kazui
  • Publication number: 20090255425
    Abstract: The invention provides a screen printing apparatus and a screen printing method with which the separability of the printing member just after printing a print material has been improved.
    Type: Application
    Filed: February 20, 2006
    Publication date: October 15, 2009
    Applicant: Hitachi Metals, Ltd.
    Inventors: Motoyuki Itoh, Kenichi Kubo
  • Publication number: 20090014502
    Abstract: An improved placing method and placing apparatus are provided for placing conductive balls in a predetermined pattern onto a base unit. In the placing method for placing balls having conductivity in a predetermined pattern onto one surface of the base unit, an arrangement member has one surface, another surface opposite to the one surface of the arrangement member and positioning openings, wherein the positioning openings are arranged corresponding to the pattern such that the openings are through from the one surface to the another surfaces of the arrangement member so that the balls are inserted therein. The another surface of the arrangement member is positioned opposite to the one surface of the base unit. The arrangement member has two or more line members of which the core axes are substantially aligned.
    Type: Application
    Filed: August 25, 2008
    Publication date: January 15, 2009
    Inventors: Motoyuki Itoh, Masanori Ochiai, Shinichi Kazui
  • Patent number: 7431792
    Abstract: Improved placing method and apparatus are provided for placing conductive balls in a predetermined pattern onto one surface of a base unit. An arrangement member is provided to have one surface, another surface opposite to the one surface of the arrangement member and positioning openings The positioning openings are arranged corresponding to the pattern so that the balls are inserted therein. The another surface of the arrangement member is opposite to the one surface of the base unit. The arrangement member has two or more line members whose core axes are substantially aligned. The transfer device is arranged so that the line members are substantially in a horizontal position to contact with the balls, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings.
    Type: Grant
    Filed: March 8, 2004
    Date of Patent: October 7, 2008
    Assignee: Hitachi Metals, Ltd.
    Inventors: Motoyuki Itoh, Masanori Ochiai, Shinichi Kazui
  • Publication number: 20060086777
    Abstract: Improved placing method and apparatus are provided for placing conductive balls in a predetermined pattern onto one surface of a base unit. An arrangement member is provided to have one surface, another surface opposite to the one surface of the arrangement member and positioning openings. The positioning openings are arranged corresponding to the pattern so that the balls are inserted therein. The another surface of the arrangement member is opposite to the one surface of the base unit. The arrangement member has two or more line members whose core axes are substantially aligned. The transfer device is arranged so that the line members are substantially in a horizontal position to contact with the balls, and then the transfer device is horizontally moved with respect to the one surface of the arrangement member. Then, the balls are placed on the one surface of the base unit through the positioning openings.
    Type: Application
    Filed: March 8, 2004
    Publication date: April 27, 2006
    Inventors: Motoyuki Itoh, Masanori Ochiai, Shinichi Kazui