Abstract: Methods and systems for anomaly correction include detecting an anomaly in a time series of categorical data values generated by a sensor, displaying a visual depiction of an anomalous time series, corresponding to the detected anomaly, on a user interface with a visual depiction of an expected normal behavior to contrast to the anomalous time series, and performing a corrective action responsive to the displayed detected anomaly. Detecting the anomaly includes framing the time series with a sliding window, generating a histogram for the categorical data values using a histogram template, generating an anomaly score for the time series using an anomaly detection histogram model on the generated histogram, and comparing the anomaly score to an anomaly threshold.

Abstract: Methods and systems for anomaly detection include training an anomaly detection histogram model using historical categorical value data. Training the anomaly detection histogram model includes generating a histogram template based on historical categorical data, converting the historical categorical data to a histogram using the histogram template, and determining a normal range and anomaly threshold for the categorical data using the histogram.

Abstract: A position detection device is a position detection device installed in an apparatus, and detecting a position of the apparatus, and includes an acceleration sensor configured to detect acceleration information of the apparatus, a static acceleration removing unit configured to remove static acceleration information indicating acceleration information in a static state of the apparatus, from the acceleration information detected by the acceleration sensor, and generate movement acceleration information indicating acceleration information in a moving state of the apparatus, an error deriving unit configured to derive an error component contained in the movement acceleration information, an acceleration correcting unit configured to correct the movement acceleration information by subtracting the error component from the movement acceleration information, and a position information acquiring unit configured to acquire position information of the apparatus based on the corrected movement acceleration information

Abstract: According to one embodiment, a magnetic storage device includes memory cells, wherein each of the memory cell includes: a wiring including a first ferromagnetic layer and a first nonmagnetic layer disposed on the first ferromagnetic layer; a magnetoresistive effect element including a second ferromagnetic layer disposed on the first nonmagnetic layer, a third ferromagnetic layer, and a second nonmagnetic layer disposed between the second and the third ferromagnetic layer; a first transistor having a first terminal connected to the first ferromagnetic layer, and a second terminal connected to a source line; and a second transistor having a first terminal connected to the third ferromagnetic layer, and a second terminal connected to a bit line.

Abstract: According to one embodiment, a magnetic storage device includes memory cells, wherein each of the memory cell includes: a wiring including a first ferromagnetic layer and a first nonmagnetic layer disposed on the first ferromagnetic layer; a magnetoresistive effect element including a second ferromagnetic layer disposed on the first nonmagnetic layer, a third ferromagnetic layer, and a second nonmagnetic layer disposed between the second and the third ferromagnetic layer; a first transistor having a first terminal connected to the first ferromagnetic layer, and a second terminal connected to a source line; and a second transistor having a first terminal connected to the third ferromagnetic layer, and a second terminal connected to a bit line.

Abstract: According to one embodiment, a memory device includes a spin transfer torque magnetoresistive element including a first magnetic layer, a second magnetic layer, and a nonmagnetic layer between the first magnetic layer and the second magnetic layer, a temperature detecting unit detecting an ambient temperature of the magnetoresistive element, and a write voltage generating unit generating a write voltage for the magnetoresistive element in accordance with the temperature detected by the temperature detecting unit.

Abstract: According to one embodiment, a magnetoresistive memory device includes a magnetoresistive element includes a first magnetic layer, a second magnetic layer, and a nonmagnetic layer between the first magnetic layer and the second magnetic layer, and a sidewall insulating film provided on a sidewall of the magnetoresistive element. The sidewall insulating film includes a first insulating film in contact with a sidewall of the second magnetic layer, a second insulating film in contact with a sidewall of the nonmagnetic layer, and a third insulating film in contact with a sidewall of the first magnetic layer. A composition of the second insulating film is different from a composition of the first and third insulating film.

Abstract: According to the embodiments, a semiconductor device having a CMOS image sensor is provided. The CMOS image sensor includes a plurality of photoelectric conversion units adapted to photoelectrically convert an incident light into signal charges; and a transfer unit adapted to transfer the signal charges generated by the photoelectric conversion unit to a floating diffusion unit from the photoelectric conversion unit. A channel portion of a transfer gate transistor of the transfer unit has at least one SiGe layer.

Abstract: According to one embodiment, a method includes forming first and second gate patterns each including a structure stacked in order of a first insulating layer, a floating gate layer, a charge trap layer, a second insulating layer and a dummy layer on a semiconductor layer, implanting impurities in the semiconductor layer by an ion implantation using the first and second gate patterns as a mask, forming a third insulating layer on the semiconductor layer, the third insulating layer covering side surfaces of the first and second gate patterns, and forming first and second concave portions, the first concave portion formed by removing the dummy layer of the first gate pattern, the second concave portion formed by removing the dummy layer, the second insulating layer, the charge trap layer and the floating gate layer of the second gate pattern.

Abstract: A nonvolatile semiconductor memory device includes a first insulating layer on a semiconductor layer, a charge storage layer on the first insulating layer, a second insulating layer on the charge storage layer, and a control gate electrode on the second insulating layer. The charge storage layer includes a floating gate layer on the first insulating layer, an interface insulating layer on the floating gate layer, and a charge trap layer on the interface insulating layer, and a lower end of a conduction band of the interface insulating layer is higher than a trap level of the charge trap layer and is lower than a lower end of a conduction band of the charge trap layer.

Abstract: According to one embodiment, a method includes forming first and second gate patterns each including a structure stacked in order of a first insulating layer, a floating gate layer, a charge trap layer, a second insulating layer and a dummy layer on a semiconductor layer, implanting impurities in the semiconductor layer by an ion implantation using the first and second gate patterns as a mask, forming a third insulating layer on the semiconductor layer, the third insulating layer covering side surfaces of the first and second gate patterns, and forming first and second concave portions, the first concave portion formed by removing the dummy layer of the first gate pattern, the second concave portion formed by removing the dummy layer, the second insulating layer, the charge trap layer and the floating gate layer of the second gate pattern.

Abstract: A nonvolatile semiconductor memory device includes a first insulating layer on a semiconductor layer, a charge storage layer on the first insulating layer, a second insulating layer on the charge storage layer, and a control gate electrode on the second insulating layer. The charge storage layer includes a floating gate layer on the first insulating layer, an interface insulating layer on the floating gate layer, and a charge trap layer on the interface insulating layer, and a lower end of a conduction band of the interface insulating layer is higher than a trap level of the charge trap layer and is lower than a lower end of a conduction band of the charge trap layer.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a first insulating layer on a semiconductor layer, a charge storage layer on the first insulating layer, a second insulating layer on the charge storage layer, and a control gate electrode on the second insulating layer. The charge storage layer includes a floating gate layer on the first insulating layer, an interface insulating layer on the floating gate layer, a first charge trap layer on the interface insulating layer, and a second charge trap layer on the first charge trap layer, and a trap level of the second charge trap layer is lower than a trap level of the first charge trap layer.

Abstract: According to one embodiment, a resistance change memory includes resistance change elements, vias and sidewall insulating layers, the elements and the vias provided alternately in a first direction and a second direction orthogonal to the first direction, and the sidewall insulating layers provided on sidewalls of the elements. The elements are provided in a lattice pattern having a constant pitch. A thickness of each of the sidewall insulating layers in a direction orthogonal to the sidewalls is a value for contacting the sidewall insulating layers each other or more to form holes between the sidewall insulating layers. The vias are provided in the holes respectively.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor substrate, a tunnel insulating film on the semiconductor substrate, a first floating gate electrode on the tunnel insulating film, an inter-floating gate insulating film on the first floating gate electrode, a second floating gate electrode on the inter-floating gate insulating film, an inter-electrode insulating film on the second floating gate electrode, and a control gate electrode on the inter-electrode insulating film. The inter-floating gate insulating film includes a main insulating film, and a first fixed charge layer between the main insulating film and the second floating gate electrode and having negative fixed charges.

Abstract: According to one embodiment, a semiconductor device includes a switch element provided in a surface area of a semiconductor substrate, a contact plug with an upper surface and a lower surface, and a function element provided on the upper surface of the contact plug. The lower surface of the contact plug is connected to the switch element. The upper surface of the contact plug has a maximum roughness of 0.2 nm or less.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a first insulating layer on a semiconductor layer, a charge storage layer on the first insulating layer, a second insulating layer on the charge storage layer, and a control gate electrode on the second insulating layer. The charge storage layer includes a floating gate layer on the first insulating layer, an interface insulating layer on the floating gate layer, and a charge trap layer on the interface insulating layer, and a lower end of a conduction band of the interface insulating layer is higher than a trap level of the charge trap layer and is lower than a lower end of a conduction band of the charge trap layer.

Abstract: According to one embodiment, a nonvolatile semiconductor memory device includes a first insulating layer on a semiconductor layer, a charge storage layer on the first insulating layer, a second insulating layer on the charge storage layer, and a control gate electrode on the second insulating layer. The charge storage layer includes a floating gate layer on the first insulating layer, an interface insulating layer on the floating gate layer, a first charge trap layer on the interface insulating layer, and a second charge trap layer on the first charge trap layer, and a trap level of the second charge trap layer is lower than a trap level of the first charge trap layer.

Abstract: According to one embodiment, a semiconductor device includes a semiconductor substrate, a tunnel insulating film on the semiconductor substrate, a first floating gate electrode on the tunnel insulating film, an inter-floating gate insulating film on the first floating gate electrode, a second floating gate electrode on the inter-floating gate insulating film, an inter-electrode insulating film on the second floating gate electrode, and a control gate electrode on the inter-electrode insulating film. The inter-floating gate insulating film includes a main insulating film, and a first fixed charge layer between the main insulating film and the second floating gate electrode and having negative fixed charges.

Abstract: According to one embodiment, a resistance change memory includes resistance change elements, vias and sidewall insulating layers, the elements and the vias provided alternately in a first direction and a second direction orthogonal to the first direction, and the sidewall insulating layers provided on sidewalls of the elements. The elements are provided in a lattice pattern having a constant pitch. A thickness of each of the sidewall insulating layers in a direction orthogonal to the sidewalls is a value for contacting the sidewall insulating layers each other or more to form holes between the sidewall insulating layers. The vias are provided in the holes respectively.