Abstract: A die includes at least two surface acoustic wave resonators having different resonant frequencies. A first of the at least two surface acoustic wave resonators includes first interdigital transducer electrodes having a first duty factor and disposed on a multilayer piezoelectric substrate. The multilayer piezoelectric substrate a layer of piezoelectric material having a lower surface bonded to an upper surface of a layer of a second material different from the piezoelectric material. A second of the at least two surface acoustic wave resonators includes second interdigital transducer electrodes having a second duty factor different from the first duty factor and disposed on the multilayer piezoelectric substrate to improve band balance of a device formed from the at least two surface acoustic wave resonators.

Abstract: A circuit comprising a receive block, a transmit block, and an antenna multiplexer. The antenna multiplexer includes an input port coupled to the transmit block, an output port coupled to the receive block, a common port for coupling to an antenna, and a receive filter coupled between the common port and the output port. The receive filter includes a first plurality of resonators coupled together in series between the common port and the output port including a compensation resonator coupled directly to the output port. A first angular range of a reflection coefficient of the antenna multiplexer over a transmission frequency band measured looking into the output port of the antenna multiplexer does not overlap with a second angular range of the conjugate of the reflection coefficient of the low noise amplifier over the transmission frequency band measured looking into an input of the low noise amplifier.

Abstract: An antenna multiplexer comprising an input port for receiving a transmission signal, a common port, an output port, a transmit filter coupled between the input port and the common port, and a receive filter coupled between the common port and the output port. The receive filter includes a first plurality of acoustic wave resonators in a series path between the common port and the output port and a second plurality of acoustic wave resonators each coupled between the series path and ground. None of the second plurality of acoustic wave resonators are coupled to the output port. The first plurality of acoustic wave resonators including a compensation resonator that is coupled to the output port and has a capacitance that is less than an average of the capacitances of the first plurality of acoustic wave resonators. A module comprising the antenna multiplexer. An electronic device comprising the antenna multiplexer.

Abstract: A surface acoustic wave device of a ladder type includes a series resonator and a parallel resonator, in which the parallel resonator includes a first reflector, a second reflector, and a comb-shaped electrode located between the first reflector and the second reflector, and the comb-shaped electrode includes a first section in which electrode fingers are formed at a constant cycle, and a second section in which electrode fingers are formed at a constant cycle different from the cycle of the first section.

Abstract: A problem is improved in which a plurality of duplexers has to be used if at least one of a transmission band and reception band for a handheld terminal partially overlaps a frequency band used in another communication system. A duplexer device includes a duplexer configured to include an antenna terminal, a transmission terminal and a reception terminal and to have a specific transmission band and reception band and a band-stop filter connected to at least one of the antenna terminal, the transmission terminal and the reception terminal via a switch and configured to suppress some of at least one of the specific transmission band and reception band in response to the switching of the switch.

Abstract: An acoustic wave device includes: a substrate; a pad formed on the substrate; a cap formed of an inorganic insulating material and located on the substrate, the cap including a cavity located in a surface of the cap at a substrate side and a penetration hole formed in a location overlapping with the pad; a terminal filling the penetration hole, coupled to the pad on the substrate, and formed of solder; and a functional element formed on an upper surface of the substrate and in the cavity, the functional element exciting an acoustic wave.

Abstract: A surface acoustic wave device of a ladder type includes a series resonator and a parallel resonator, in which the parallel resonator includes a first reflector, a second reflector, and a comb-shaped electrode located between the first reflector and the second reflector, and the comb-shaped electrode includes a first section in which electrode fingers are formed at a constant cycle, and a second section in which electrode fingers are partially formed at a constant cycle different from the cycle of the first section.

Abstract: A problem is improved in which a plurality of duplexers has to be used if at least one of a transmission band and reception band for a handheld terminal partially overlaps a frequency band used in another communication system. A duplexer device includes a duplexer configured to include an antenna terminal, a transmission terminal and a reception terminal and to have a specific transmission band and reception band and a band-stop filter connected to at least one of the antenna terminal, the transmission terminal and the reception terminal via a switch and configured to suppress some of at least one of the specific transmission band and reception band in response to the switching of the switch.

Abstract: A duplexer device having a plurality of duplexers mounted on a substrate for mounting a duplexer includes: a substrate for mounting a duplexer, the substrate having a rectangular shape including a first side, a second side neighboring the first side and connected to the first side, a third side facing the second side and neighboring the first side, and a fourth side connected to the second and the third sides and facing the first side, and a plurality of pads being formed on a surface of the substrate; a first duplexer mounted on the substrate for mounting a duplexer and including a first antenna, terminal, a first transmission terminal and a first reception terminal; and a second duplexer mounted on the substrate for mounting a duplexer and including a second antenna terminal, a second transmission terminal and a second reception terminal.

Abstract: An acoustic wave device built-in module includes: a multilayer wiring board formed by stacking an insulating layer and a wiring layer; an acoustic wave device embedded in the multilayer wiring board; and an electronic component located on the multilayer wiring board and electrically coupled to the acoustic wave device, wherein the acoustic wave device includes: an electrode that is located on a substrate and excites an acoustic wave; and a sealing portion that includes a frame body located on the substrate so as to surround the electrode and a lid located on the frame body so as to form an air space above the electrode, and the lid is recessed toward the substrate.

Abstract: An acoustic wave device includes: a multilayer structure that has plural surfaces which principal surfaces of plural layers provide; a chip including an acoustic wave filter and mounted on a first surface; a resin unit sealing the chip; a wiring pattern that is formed on a second surface and electrically connected to at least one of resonators; a ground pattern that is formed on the second surface along a part of the wiring pattern, and is away from the wiring pattern; and an external terminal that is formed on a third surface and electrically connected to the wiring pattern and the ground pattern, the third surface being disposed on an opposite side of the first surface with respect to the second surface; wherein a part of the wiring pattern that comes closest to the ground pattern is substantially formed in parallel with the ground pattern.

Abstract: An acoustic wave device includes: a substrate; a pad formed on the substrate; a cap formed of an inorganic insulating material and located on the substrate, the cap including a cavity located in a surface of the cap at a substrate side and a penetration hole formed in a location overlapping with the pad; a terminal filling the penetration hole, coupled to the pad on the substrate, and formed of solder; and a functional element formed on an upper surface of the substrate and in the cavity, the functional element exciting an acoustic wave.

Abstract: An electronic component includes: a wiring substrate; a passive component that includes a substrate, a coil located on an upper surface of the substrate, and a terminal located on a lower surface of the substrate and electrically connected to the coil, and is mounted on an upper surface of the wiring substrate by using the terminal; and a grounding wiring that is located on the wiring substrate and overlaps with the coil in a thickness direction of the wiring substrate.

Abstract: An acoustic wave device built-in module includes: a multilayer wiring board formed by stacking an insulating layer and a wiring layer; an acoustic wave device embedded in the multilayer wiring board; and an electronic component located on the multilayer wiring board and electrically coupled to the acoustic wave device, wherein the acoustic wave device includes: an electrode that is located on a substrate and excites an acoustic wave; and a sealing portion that includes a frame body located on the substrate so as to surround the electrode and a lid located on the frame body so as to form an air space above the electrode, and the lid is recessed toward the substrate.

Abstract: An acoustic wave device includes: a multilayer structure that has plural surfaces which principal surfaces of plural layers provide; a chip including an acoustic wave filter and mounted on a first surface; a resin unit sealing the chip; a wiring pattern that is formed on a second surface and electrically connected to at least one of resonators; a ground pattern that is formed on the second surface along a part of the wiring pattern, and is away from the wiring pattern; and an external terminal that is formed on a third surface and electrically connected to the wiring pattern and the ground pattern, the third surface being disposed on an opposite side of the first surface with respect to the second surface; wherein a part of the wiring pattern that comes closest to the ground pattern is substantially formed in parallel with the ground pattern.

Abstract: A balance filter includes a first filter having first multimode surface acoustic wave (SAW) filters connected in parallel, a second filter that is connected to the first filter and includes a second multimode SAW filter, a first terminal connected to the first filter, and second terminals connected to the second filter. An input terminal of the balance filter is one of the first and second terminals, and an output terminal thereof is the other. Electric signals transmitted from the first to second filters or vice versa are in opposite phase. Electric signals are input or output via the second terminals in opposite phase.

Abstract: A surface acoustic wave device includes a supporting substrate, a LiTaO3 piezoelectric substrate joined on the supporting substrate, which has a normal line direction on a main surface thereof in a direction rotated 43° to 53° from a Y axis to a Z axis direction about an X axis, and an electrode pattern formed on the piezoelectric substrate.

Abstract: A surface acoustic wave device includes a supporting substrate, a LiTaO3 piezoelectric substrate joined on the supporting substrate, which has a normal line direction on a main surface thereof in a direction rotated 43° to 53° from a Y axis to a Z axis direction about an X axis, and an electrode pattern formed on the piezoelectric substrate.

Abstract: A balance filter includes a first filter having first multimode surface acoustic wave (SAW) filters connected in parallel, a second filter that is connected to the first filter and includes a second multimode SAW filter, a first terminal connected to the first filter, and second terminals connected to the second filters. An input terminal of the balance filter is one of the first and second terminals, and an output terminal thereof is the other. Electric signals transmitted from the first to second filters or vice versa are in opposite phase. Electric signals are input or output via the second terminals in opposite phase.

Abstract: A surface acoustic wave filter capable of obtaining a low insertion loss and wide bandwidth characteristic is provided. The surface acoustic wave filter includes a piezoelectric substrate; a pair of reflective electrodes formed on the piezoelectric substrate; and a plurality of comb electrodes formed between the pair of reflective electrodes on the piezoelectric substrate, wherein, in regard to the neighboring two comb electrodes among the plurality of comb electrodes, an electrode pitch of one comb electrode is set so that continuously varying phases of surface acoustic waves respectively generated by the two comb electrodes are obtained in a gap opposite to an outermost finger electrode of the other neighboring comb electrode.