Abstract: The present invention aims to provide a resin composition superior in all of resistance to moisture permeability, adhesive strength and transparency. This object is achieved by a resin composition containing 3-38 parts by mass of (B) calcined hydrotalcite, 1-16 parts by mass of (C) talc, and 1-16 parts by mass of (D) silica based on 80 parts by mass of (A) an epoxy resin.

Abstract: The present invention aims to provide a resin composition superior in all of resistance to moisture permeability, adhesive strength and transparency. This object is achieved by a resin composition containing (A) an epoxy resin and (B) hydrotalcite having a BET specific surface area of not less than 65 m2/g.

Abstract: The present invention aims to provide a resin composition superior in all of resistance to moisture permeability, adhesive strength and transparency. This object is achieved by a resin composition containing 3-38 parts by mass of (B) calcined hydrotalcite, 1-16 parts by mass of (C) talc, and 1-16 parts by mass of (D) silica based on 80 parts by mass of (A) an epoxy resin.

Abstract: The problem of the present invention is to provide a curable resin composition having a low dielectric tangent and affording a cured product superior in the adhesion strength to a conductor. According to the present invention, a curable resin composition comprising curable polyvinylbenzyl compound (A), and modified styrene elastomer (B) having one or more kinds of not less than one functional group selected from the group consisting of a hydroxyl group, a carboxyl group, an amino group and an acid anhydride group is provided. In this composition, dielectric powder (C) is easily dispersed, and a composition containing powder (C) can afford a cured product having a high dielectric constant. By curing the composition of the present invention, an insulating layer preferable for electrical circuits can be provided.