Patents by Inventor Motoyuki Toriakai

Motoyuki Toriakai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition for sealing semiconductors
    Patent number: 5134204
    Abstract: A resin composition for sealing semiconductors which shows high heat resistance and is suitable for sealing semiconductor devices, etc., and which comprises an organic component containing a polymaleimide compound represented by the general formula: ##STR1## where R.sub.1 is a m-valent organic group having at least 2 carbon atoms and m is a positive integer of 2 or more, epoxy compounds mainly consisting of an epoxy compound represented by the general formula: ##STR2## where n is a positive integer of 3-16 and a compound having two or more phenolic hydroxyl groups, and an inorganic filler.
    Type: Grant
    Filed: May 1, 1990
    Date of Patent: July 28, 1992
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Motoyuki Toriakai, Koutarou Asahina, Mikio Kitahara, Koichi Machida, Takayuki Kubo