Patents by Inventor Motozo Horikawa

Motozo Horikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Housing for an electronic control unit and method of manufacture
    Patent number: 10398021
    Abstract: A housing assembly for an electronic circuit including an electronic control unit (ECU) is a low-profile, generally rectangular device that includes a base, a cover that closes an open end of the base, and a printed circuit board (PCB). The housing assembly securely supports the PCB and its associated electronic components while providing improved cooling properties and lower manufacturing costs. This is achieved by providing passive cooling features on an outer surface of the cover, and by employing a thermally conductive plastic to form the passive cooling features, where the cover has predetermined and defined anisotropic thermal conduction properties configured to optimize thermal conduction and cooling of the ECU.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: August 27, 2019
    Assignees: Robert Bosch LLC, Robert Bosch GmbH
    Inventors: Hiram Avalos, Jeff Reuter, Mark Ryskamp, Motozo Horikawa
  • Housing for a camera and method of manufacture
    Patent number: 10098267
    Abstract: An electronic device includes a housing, a printed circuit board (PCB) disposed in the housing, and electronic components that are supported on the PCB. The housing is an assembly of a cover and a base. At least one of the cover and the base include a region in which at least a portion of an outer surface of the housing within the region, and a portion of housing material adjoining the portion of the outer surface, have material properties that are different than those in other regions. A method of manufacturing that provides the desired material properties is also described.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: October 9, 2018
    Assignees: Robert Bosch LLC, Robert Bosch GmbH
    Inventors: John Janson, Ligor Manushi, Alexander Moore, Hiram Avalos, Robert Keller, Mark Ryskamp, Motozo Horikawa
  • Housing for an Electronic Control Unit and Method of Manufacture
    Publication number: 20180042101
    Abstract: A housing assembly for an electronic circuit including an electronic control unit (ECU) is a low-profile, generally rectangular device that includes a base, a cover that closes an open end of the base, and a printed circuit board (PCB). The housing assembly securely supports the PCB and its associated electronic components while providing improved cooling properties and lower manufacturing costs. This is achieved by providing passive cooling features on an outer surface of the cover, and by employing a thermally conductive plastic to form the passive cooling features, where the cover has predetermined and defined anisotropic thermal conduction properties configured to optimize thermal conduction and cooling of the ECU.
    Type: Application
    Filed: August 1, 2017
    Publication date: February 8, 2018
    Inventors: Hiram Avalos, Jeff Reuter, Mark Ryskamp, Motozo Horikawa