Abstract: This invention relates generally to an apparatus having an improved way of connecting test leads of an electrical component to be tested to leads of a test device. The apparatus has a connector housing in which the test leads are disposed and an opening into which the component leads are inserted. Also disposed within the housing is a clamp that can be moved against the component lead to mate the component lead with the test lead. A source of pressure moves the clamp to mate the leads. Preferably, the control system for moving the clamp is pneumatic. Mating the leads with a pneumatic system is efficient, and provides control over the electrical resistance that is formed between the mating leads.