Abstract: A semiconductor wafer includes a plurality of chips arranged in a matrix and a plurality of scribe lines separating the chips from one another. A polyimide overcoat film covering each chip except for electrode pads of the chip has a bank crossing the scribe line for preventing the ground particles generated by grinding the bottom surface of the wafer from entering the chip along the scribe lines.

Abstract: A semiconductor wafer includes a plurality of chips arranged in a matrix and a plurality of scribe lines separating the chips from one another. A polyimide overcoat film covering each chip except for electrode pads of the chip has a bank crossing the scribe line for preventing the ground particles generated by grinding the bottom surface of the wafer from entering the chip along the scribe lines.

Abstract: It is an object of the invention to ensure a signal transmission time of a data out buffer circuit of a SRAM which adopts a pre-charge system. The data out buffer circuit is provided with a pre-charge circuit for pre-charging a write/read bus during a period of pre-charge and a data latch circuit for holding a data read before then during the period of pre-charge. The data out buffer circuit outputs the data held in the data latch circuit during the period of pre-charge to the outside via a data output circuit. The reliability of the data transmission achieved by the extended holding time of the output data and the improvement of access speed achieved by pre-charge can be both realized.