Patents by Inventor Mu Chang Sung

Mu Chang Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240084474
    Abstract: The present invention relates to a metal-polymer resin composite in which a polymer resin is directly injection-molded to a zinc alloy, a magnesium alloy, or a die-casting part thereof, and thus an injection product is directly bonded to a metal surface, wherein in the case of a hard polymer resin, a tensile strength of the metal and the polymer resin is 30 MPa or greater, and in the case of a soft polymer resin, a tensile strength of the metal and the polymer resin is 20 MPa or greater, and an average helium leakage after 10 times of measurement is 10?8 Pa·m3/s or less, and a novel method for preparing the same.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 14, 2024
    Applicant: PLASTAL CO., LTD.
    Inventors: Mu Chang SUNG, Jae Ik KIM, Jae Hwa KIM, Sung Ho HONG
  • Publication number: 20230108887
    Abstract: The present disclosure provides a method for preparing a titanium-resin assembly for improving the adhesion strength between a substrate containing titanium and a resin, which includes: a first pore formation step of immersing a substrate comprising titanium in a first solution and forming pores in the substrate by etching the same; a second pore formation step of immersing the substrate having pores formed in the first pore formation step in a second solution and forming another pores by etching the same; an electrolysis step of immersing the substrate that has undergone the second pore formation step in an electrolytic solution and conducting electrolysis; and a molding step of joining the substrate with a polymer resin and conducting injection molding, wherein the first solution is an alkaline solution with a pH>7 and the second solution is an acidic solution with a pH<7.
    Type: Application
    Filed: June 22, 2021
    Publication date: April 6, 2023
    Inventors: Mu Chang Sung, Jae Ik Kim, Jae Hwa Kim, Sung Ho Hong