Abstract: A light guide plate includes a light incident section and a light guiding section. The light incident section includes a light incident surface configured to receive light beams emitted from a light source, a top surface adjacent to the light incident surface, a first bottom surface oppose to the top surface. The light guiding section includes a main light emitting surface, a connecting surface connecting the main light emitting surface with the top surface, a second bottom surface opposite to the main light emitting surface and connecting with the first bottom surface, and a contacting surface connecting with the main light emitting surface and the second bottom surface. A step is formed at a junction of the light incident section and the light guiding section, and the connecting surface and the top surface define an accommodating space.

Abstract: A light guide plate includes a light incident section and a light guiding section. The light incident section includes a light incident surface configured to receive light beams emitted from a light source, a top surface adjacent to the light incident surface, a first bottom surface oppose to the top surface. The light guiding section includes a main light emitting surface, a connecting surface connecting the main light emitting surface with the top surface, a second bottom surface opposite to the main light emitting surface and connecting with the first bottom surface, and a contacting surface connecting with the main light emitting surface and the second bottom surface. A step is formed at a junction of the light incident section and the light guiding section, and the connecting surface and the top surface define an accommodating space.

Abstract: A detachable tablet display device includes a display, and an assisting platform detachably connected to the display. The display includes a touch screen, a CPU, a wireless receiving module electrically connected to the CPU, and a television module electrically connected to the CPU. The wireless receiving module is capable of receiving a wireless network signal.

Abstract: An exemplary brittle non-metallic workpiece (80) defines a through hole (82). An inner surface (822) for forming the through hole has no microcracks and burrs. A method for making a through hole in a brittle non-metallic substrate (50) is also provided. The method includes as follows: forming an enclosing sketched etch (66) engraved into a brittle non-metallic substrate with a given depth (H) from a surface of the brittle non-metallic substrate; placing a cooling object (74) on an excess portion (68) inside the enclosing sketched etch (66); and extending the enclosing sketched etch through the brittle non-metallic substrate.

Abstract: An exemplary brittle non-metallic workpiece (70) is made by the laser beam (31), a cutting surface (701 ) of the brittle non-metallic workpiece has no micro cracks. A method for making the brittle non-metallic workpiece includes: focusing a laser beam on the brittle non-metallic substrate to form an elliptic beam spot; driving the laser beam to move along a predetermined curved cutting path, making a center of a major axis of the elliptic beam spot intersecting along the predetermined curved cutting path and the major axis being tangent to the predetermined curved cutting path at the intersecting point; a coolant stream following the elliptic beam spot to move, thus producing a crack in the brittle non-metallic substrate corresponding to the predetermined curved cutting path; separating the brittle non-metallic substrate along the crack. A laser cutting device (40) for making the same is also provided.

Abstract: A building includes a wall and a roof. The wall encloses an enclosed area, and the wall comprises a plurality of standardized modules, each having an inner space used as a room. The roof covers the enclosed area. The standardized modules are standardized, and thus very convenient to manufacture. In addition, the standardized modules can be transported quickly and efficiently, therefore, the building as disclosed is convenient and reliable to construct and dismantle.

Abstract: An electronic device housing and a method of forming the housing are disclosed. The electronic device housing, comprises a bottom layer defining a though hole; an adhesion layer on the bottom layer defining a through hole; and a protection layer on the adhesion layer defining a through hole, wherein the adhesion layer is cured by ultraviolet (UV) rays, the adhesion layer is adapted to tightly combine the bottom layer and the protection layer.

Abstract: A method for manufacturing a shell includes the following steps. A diaphanous mold having a cavity is provided. A plastic layer is disposed on a surface of the cavity of the diaphanous mold. A glue layer is disposed on the plastic layer. A substrate is disposed on and contacting the glue layer. The glue layer is solidified such that the substrate is adhered on the plastic layer by the solidified glue layer. The shell which comprises the substrate, the glue layer, and the plastic layer is separated from the diaphanous mold.

Abstract: An electronic device housing includes a bottom layer, a adhesion layer and a protection layer. The adhesion layer is located on the bottom layer. The protection layer is located on the adhesion layer. The electronic device housing has excellent appearance and high durability. The present disclosure also provides a method of manufacturing the electronic device housing.

Abstract: The disclosure provides a method for manufacturing a product shell. A diaphanous mold with a recess and a coating layer located inside the recess are provided. A substrate is disposed inside the recess. The coating layer is located between the recess and the substrate. The coating layer is cured to combine with the substrate by a curing device through the diaphanous mold. The substrate is then removed from the diaphanous mold to form the product shell.

Abstract: A surface treating method of a metal housing includes the following steps. First, a workpiece is provided. The workpiece includes a surface formed by a metal material. Thereafter, the workpiece is pre-treated to clean the surface of the metal material. Next, a titanium diffusion treating is performed on the workpiece to form a titanium-containing diffusion layer on the surface of the metal material.

Abstract: A building includes a wall and a roof. The wall encloses an enclosed area, and the wall comprises a plurality of standardized modules, each having an inner space used as a room. The roof covers the enclosed area. The standardized modules are standardized, and thus very convenient to manufacture. In addition, the standardized modules can be transported quickly and efficiently, therefore, the building as disclosed is convenient and reliable to construct and dismantle.

Abstract: The present disclosure discloses a building including a wall and a roof. The wall encloses an enclosed area. The wall includes a plurality of serialized modules, and at least one of the serialized modules is a functional module having accessories with corresponding functions. The roof covers the enclosed area. The building as disclosed is convenient and reliable to construct and dismantle, because the modules can be transported quickly and efficiently and at least one of the serialized modules has desired function.

Abstract: An exemplary lens holder (30) includes a lens holding platform (35), a base (31), a resilient element (33), and three platform supporting members (32). The platform supporting members (32) connect the lens holding platform (35) with the base (31), and are aligned on different axes. The resilient element (33) is positioned between the lens holding platform (35) and the base (31), and configured for uniformly resisting the lens holding platform (35) away from the base (31). One of the three platform supporting members (32) is adjustable, thus adjusting a gradient of the lens holding platform (35) relative to the base (31).

Abstract: An exemplary lens holder (30) includes a lens holding platform (35), a base (31), a resilient element (33), and three platform supporting members (32). The platform supporting members (32) connect the lens holding platform (35) with the base (31), and are aligned on different axes. The resilient element (33) is positioned between the lens holding platform (35) and the base (31), and configured for uniformly resisting the lens holding platform (35) away from the base (31). One of the three platform supporting members (32) is adjustable, thus adjusting a gradient of the lens holding platform (35) relative to the base (31).

Abstract: An exemplary brittle non-metallic workpiece (70) is made by the laser beam (31), a cutting surface (701 ) of the brittle non-metallic workpiece has no micro cracks. A method for making the brittle non-metallic workpiece includes: focusing a laser beam on the brittle non-metallic substrate to form an elliptic beam spot; driving the laser beam to move along a predetermined curved cutting path, making a center of a major axis of the elliptic beam spot intersecting along the predetermined curved cutting path and the major axis being tangent to the predetermined curved cutting path at the intersecting point; a coolant stream following the elliptic beam spot to move, thus producing a crack in the brittle non-metallic substrate corresponding to the predetermined curved cutting path; separating the brittle non-metallic substrate along the crack. A laser cutting device (40) for making the same is also provided.

Abstract: An exemplary brittle non-metallic workpiece (80) defines a through hole (82). An inner surface (822) for forming the though hole has no microcracks and burrs. A method for making a through hole in a brittle non-metallic substrate (50) is also provided. The method includes as follows: forming an enclosing sketched etch (66) engraved into a brittle non-metallic substrate with a given depth (H) from a surface of the brittle non-metallic substrate; placing a cooling object (74) on an excess portion (68) inside the enclosing sketched etch (66); and extending the enclosing sketched etch through the brittle non-metallic substrate.