Abstract: A LED bulb with a remote controller is disclosed. The equipment includes a remote controller and a LED illuminator set, wherein the LED illuminator set comprises a base including a LED luminary, a circuitry controller, and an encoder; a globe engaged with the base; a base casing for housing the base; and a receiver disposed on the surface of the casing for receiving coded signal from the remote controller. Thereby the circuitry controller is controlled in response to the coded signal and make the LED illuminator providing a light in a demanding color.

Abstract: A light emitting diode comprises a sealed part, and at least two pins extending outward from the sealing part. The sealed part further comprises a connecting pole integrated with at least one pin, a base integrated with at least another pin, a chip received in the base, and a brazed wire connecting with the chip and the connecting pole respectively. It is characterized in that the base is free from sealing at the bottom area thereof having cone tip.

Abstract: An light emitting diode with improved heat dissipation has a frame, a chip, a wire solder, and sealing compound. The frame is integrally made of conductive metal sheet and provides two sets of connecting pins with two connecting pins for each set. A middle connection has two connecting pins and a middle plate has two connecting pins. A recess cup located in the middle part of the middle plate. The chip is placed and located in said recess cup and a conductive wire is joined to the chip and to the middle connection. The sealing compound covers the chip, the wide part of the plate connection and part of the middle plate and forms a light head on top of the chip. The middle plate has a width greater than that of said connecting pins and middle connection and a lower portion of the middle plate is exposed outside the sealing compound for a better dissipation of heat.

Abstract: An improved light emitting diode, comprises a frame, a chip, a wire solder, and sealing compound. The frame is integrally made of conductive metal sheet and provides two sets of connecting pins with two connecting pins for each set. A middle connection is vertically joined to two connecting pins in one set thereof and a plate connection is vertically joined to two connecting pins in the other set thereof. A recess cup is formed at the middle part of the plate connection near the middle connection. The chip is placed and located in said recess cup. The wire solder is made of conductive metal wire and an end thereof is joined to the chip and the other end thereof is joined to the middle connection. The sealing compound covers the chip, the wire solder, part of the plate connection and part of the middle connection and forms a light head on top of the chip.