Abstract: A super thin heating disk includes an upper cover made of metal, the upper cover being formed with a receiving groove; a lower cover made of metal and installed within the receiving groove; the heating coil being distributed in the receiving groove; a heating coil installed within the receiving groove, two ends of the heating coil being installed with two electrodes, respectively, which are connected to external positive and negative electrodes for current conduction; a thermal couple installed in the receiving groove for detecting temperatures of the heating coil; the thermal couple being connected to two connection wires for conducting external transmission lines so that detection temperature data can be transferred out; and two insulation layers installed in the receiving groove and at an upper and a lower side of the heating coil.

Abstract: A PVD reactor with a magnetic rotation mechanism comprises a base installed to a top of an interior of a reactor; a retaining gear fixedly installed at a bottom surface of the base; a central shaft rotatably passing through the base and the retaining gear; a driver for driving the central shaft to rotate; a rotation arm having a receiving groove for receiving the retaining gear; a rotation gear rotatably installed within the receiving groove and engaged with the retaining gear; a center of the rotation gear having a gear shaft; a magnetic disk installed to a lower end of the gear shaft; the magnetic disk containing a plurality of disk bodies which are parallel and a plurality of magnets; the magnets being formed as two spinal shapes which are alternatively arranged and contains two opposite polarities; and a balance block serving to balance the weight of the magnetic disk.

Abstract: A vapor reduction device for a semiconductor wafer has a plurality of heat plates which are spaced arranged longitudinally for receiving a plurality of wafers, the heat plates are integrated into a heating frame which is further placed into a casing. The movements of the heat plates within the casing causes that the wafers can be heated rapidly and uniformly so as to evaporated vapor effectively. The heat plates are separable from the heating frame and thus a number of the heat plates is selectable as desired. The heating temperature for the heat plates is controllable independently so that the temperatures of the wafers are controllable so that the temperature differences of the wafers are controllable to be uniformly distributed.

Abstract: A plasma etching reaction chamber includes a casing having a receiving chamber; a base liftably installed below the receiving chamber; a first electrode and a second electrode; and a radio frequency electrode rod. The second electrode has a plurality of water channels and a bottom of the second electrode is installed with two cooling water tubes which are communicated with the plurality of water channels; upper sides of the two cooling water tubes are hidden within the driving rod and lower sides thereof extend downwards to be out of the casing so that external cooling water can flow into the cooling water tubes and then to the water channels to achieve the object of cooling.