Patents by Inventor Mu Hung CHOU

Mu Hung CHOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for processing wafer-shaped articles
    Patent number: 11195730
    Abstract: A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: December 7, 2021
    Assignee: Lam Research AG
    Inventors: Rainer Obweger, Andreas Gleissner, Thomas Wirnsberger, Franz Kumnig, Alessandro Baldaro, Christian Thomas Fischer, Mu Hung Chou, Rafal Ryszard Dylewicz, Nathan Lavdovsky, Ivan L. Berry, III
  • METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES
    Publication number: 20200090956
    Abstract: A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.
    Type: Application
    Filed: November 22, 2019
    Publication date: March 19, 2020
    Inventors: Rainer Obweger, Andreas Gleissner, Thomas Wirnsberger, Franz Kumnig, Alessandro Baldaro, Christian Fischer, Mu Hung Chou, Rafal Ryszard Dylewicz, Nathan Lavdovsky, Ivan L. Berry
  • Method and apparatus for processing wafer-shaped articles
    Patent number: 10490426
    Abstract: A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: November 26, 2019
    Assignee: LAM RESEARCH AG
    Inventors: Rainer Obweger, Andreas Gleissner, Thomas Wirnsberger, Franz Kumnig, Alessandro Baldaro, Christian Thomas Fischer, Mu Hung Chou, Rafal Ryszard Dylewicz, Nathan Lavdovsky, Ivan L. Berry, III
  • METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES
    Publication number: 20160064242
    Abstract: A device for processing wafer-shaped articles comprises a closed process chamber that provides a gas-tight enclosure. A rotary chuck is located within the closed process chamber. A heater is positioned relative to the chuck so as to heat a wafer shaped article held on the chuck from one side only and without contacting the wafer shaped article. The heater emits radiation having a maximum intensity in a wavelength range from 390 nm to 550 nm. At least one first liquid dispenser is positioned relative to the chuck so as to dispense a process liquid onto a side of a wafer shaped article that is opposite the side of the wafer-shaped article facing the heater.
    Type: Application
    Filed: August 26, 2014
    Publication date: March 3, 2016
    Inventors: Rainer OBWEGER, Andreas GLEISSNER, Thomas WIRNSBERGER, Franz KUMNIG, Alessandro BALDARO, Christian Thomas FISCHER, Mu Hung CHOU, Rafal Ryszard DYLEWICZ, Nathan LAVDOVSKY, Ivan L. Berry, III