Patents by Inventor Mu-Jin Kim

Mu-Jin Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11981276
    Abstract: An external material for vehicles may include a non-woven fabric having a honeycomb structure and a wheel guard including the same.
    Type: Grant
    Filed: June 11, 2021
    Date of Patent: May 14, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, HADO FNC CO., LTD., YONG SAN CO., LTD.
    Inventors: Seong Je Kim, Keun Young Kim, Ji Wan Kim, Jung Wook Lee, Jong Eun Ha, Young Su Kim, Sang Hoon Lee, Mu Jin Kim
  • Publication number: 20220048452
    Abstract: An external material for vehicles may include a non-woven fabric having a honeycomb structure and a wheel guard including the same.
    Type: Application
    Filed: June 11, 2021
    Publication date: February 17, 2022
    Applicants: Hyundai Motor Company, Kia Corporation, Hado FNC Co., Ltd., Yong San Co., Ltd.
    Inventors: Seong Je Kim, Keun Young Kim, Ji Wan Kim, Jung Wook Lee, Jong Eun Ha, Young Su Kim, Sang Hoon Lee, Mu Jin Kim
  • Patent number: 10664023
    Abstract: An electronic device includes a bracket having a through hole, a first circuit board and a second circuit board which are disposed below the bracket. The second circuit board is electrically connected with the first circuit board, and a first module and a second module are disposed above the bracket. The first module and the second module are electrically connected with the first circuit board via a wiring structure passing through the through hole.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: May 26, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae Sik Kim, Myung Jae Jo, Hye Won Kang, Ja Myeong Koo, Mu Jin Kim, Jeong Woon Koo, Dae Heon Kwon, Sei Neu Park, Won Hyun Park, Jae Young Yun
  • Patent number: 10090184
    Abstract: A carrier substrate includes: a base substrate; a first coating layer on a first surface of the base substrate; and a second coating layer on a second surface of the base substrate. The thermal expansion coefficients of the first coating layer and the second coating layer are greater than a thermal expansion coefficient of the base substrate, and a thickness of the first coating layer is different from a thickness of the second coating layer.
    Type: Grant
    Filed: May 27, 2016
    Date of Patent: October 2, 2018
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dong-Min Lee, Young-Sik Yoon, Mu-Gyeom Kim, Mu-Jin Kim, Jae-Hyun Park
  • Publication number: 20180017999
    Abstract: An electronic device includes a bracket having a through hole, a first circuit board and a second circuit board which are disposed below the bracket. The second circuit board is electrically connected with the first circuit board, and a first module and a second module are disposed above the bracket. The first module and the second module are electrically connected with the first circuit board via a wiring structure passing through the through hole.
    Type: Application
    Filed: July 14, 2017
    Publication date: January 18, 2018
    Inventors: Tae Sik KIM, Myung Jae JO, Hye Won KANG, Ja Myeong KOO, Mu Jin KIM, Jeong Woon KOO, Dae Heon KWON, Sei Neu PARK, Won Hyun PARK, Jae Young YUN
  • Publication number: 20160276202
    Abstract: A carrier substrate includes: a base substrate; a first coating layer on a first surface of the base substrate; and a second coating layer on a second surface of the base substrate. The thermal expansion coefficients of the first coating layer and the second coating layer are greater than a thermal expansion coefficient of the base substrate, and a thickness of the first coating layer is different from a thickness of the second coating layer.
    Type: Application
    Filed: May 27, 2016
    Publication date: September 22, 2016
    Inventors: Dong-Min Lee, Young-Sik Yoon, Mu-Gyeom Kim, Mu-Jin Kim, Jae-Hyun Park
  • Patent number: 9355877
    Abstract: A carrier substrate includes: a base substrate; a first coating layer on a first surface of the base substrate; and a second coating layer on a second surface of the base substrate. The thermal expansion coefficients of the first coating layer and the second coating layer are greater than a thermal expansion coefficient of the base substrate, and a thickness of the first coating layer is different from a thickness of the second coating layer.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: May 31, 2016
    Assignee: Samsung Display Co., Ltd.
    Inventors: Dong-Min Lee, Young-Sik Yoon, Mu-Gyeom Kim, Mu-Jin Kim, Jae-Hyun Park
  • Publication number: 20140065393
    Abstract: A carrier substrate includes: a base substrate; a first coating layer on a first surface of the base substrate; and a second coating layer on a second surface of the base substrate. The thermal expansion coefficients of the first coating layer and the second coating layer are greater than a thermal expansion coefficient of the base substrate, and a thickness of the first coating layer is different from a thickness of the second coating layer.
    Type: Application
    Filed: March 13, 2013
    Publication date: March 6, 2014
    Applicant: SAMSUNG DISPLAY CO., LTD.
    Inventors: Dong-Min Lee, Young-Sik Yoon, Mu-Gyeom Kim, Mu-Jin Kim, Jae-Hyun Park