Abstract: Automated patching techniques to correct certain rule violations are used, simplifying and automating the design layout of an electronic circuit, whether embodied as a design encoding or as a fabricated electronic circuit. A series of patches of predefined orientations are utilized to correct design rule violations. A set of violations are identified, patches of a predefined orientation are attempted to correct one or more violations. Patches of another predefined orientation are attempted to correct remaining violations. Attempted patching is repeated until all patches in the series have been attempted or all violations have been corrected. Patches can be added to a construction layer over the set of violations, and each patch that does not cause a design rule violation can be copied to a metal layer. A series of patches of predefined orientations are used, efficiently correcting design rule violations such as minimum area and jog rule violations.

Abstract: In a computer-aided design environment, a technique for automating design rule check error corrections in a CAD environment contemplates the use of an automation program, such as a SKILL program, to automatically and continuously run a design rule check utility program to generate intermediate results which are processed by the automation program and then supplied back to the design rule check utility program again for execution. The whole process is repeated, in an iterative manner, as many times as needed until a final result is achieved.

Abstract: A method, apparatus and computer program product for checking of integrated circuit design files using rules files. Each of the rules files has a rule associated therewith. The rules are sequentially compared with objects associated with the design files in an object-to-check-pool (OTCP). The sequence in which the rules are compared to objects in the OTCP is arrange to maximize a probability of determining whether design characteristics of the objects in the OTCP satisfies all rules associated with the rules files while minimizing a number of rules that must be compared with the OTCP.

Abstract: Method and apparatus for checking integrated circuit designs. In particular, one embodiment of the present invention is a method that for checking integrated circuit design files using (design rule check)/(electrical rule check) files (DRC/ERC files) wherein design objects are disposed on a grid having a system resolution, the method comprising steps of: (a) growing one or more rectangular boxes having at least two sides of length equal to the system resolution outward or inward from one or more of an edge of a design object and a side of a design object; (b) performing one or more of a spacing DRC/ERC check and an overlay DRC/ERC check; and (c) identifying checks relating to the rectangular boxes.

Abstract: An integrated circuit has a plurality of metal layers separated by a plurality of insulating layers. The integrated circuit comprises a pair of conductors on a first metal layer; at least one conductive fill element disposed between the conductors; and a via connecting the fill element to a ground contact on a metal layer adjacent to said first metal layer, where the via is formed of a conductive material.

Abstract: For an integrated circuit having multiple metal layers, a computer-aided design (CAD) method for designing grounded fill in the integrated circuit includes: (a) finding the eligible fill areas for each metal layer; (b) storing the eligible fill area data for each metal layer in an overflow memory; (c) finding ground contact areas for each metal layer; (d) storing the ground contact area data for each metal layer in an overflow memory; (e) temporarily storing the eligible fill area data for a selected metal layer and the ground contact area data for the metal layers adjacent to the selected metal layer in active memory; (f) fitting a fill pattern to an eligible fill area in the selected metal layer, where the fill pattern is composed of at least one element; (g) checking the adjacent metal layers for a ground contact where the element of the fill pattern may be grounded; (h) locating a conductive via between the element of the fill pattern and a ground contact in an adjacent layer; and (i) repeating steps (e)

Abstract: An integrated circuit has a plurality of metal layers separated by a plurality of insulating layers. The integrated circuit comprises a pair of conductors on a first metal layer; at least one conductive fill element disposed between the conductors; and a via connecting the fill element to a ground contact on a metal layer adjacent to said first metal layer, where the via is formed of a conductive material.