Patents by Inventor Mu-kyoung Jung

Mu-kyoung Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7410843
    Abstract: An SRAM cell that may reduce or eliminate floating body effect when using a SOI and a method for fabricating the same are provided. A floating body of an access transistor of the SRAM is connected to a source region of a driver transistor, for example, through a body extension region extending from an active region. A silicide layer may be formed or a ground line contact may be over-etched to form a conductive contact plug that may provide a current path between the body exterior regions and the source region of the driver transistor.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: August 12, 2008
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Mu-Kyoung Jung, Young-Wug Kim, Hee-Sung Kang
  • Publication number: 20060246605
    Abstract: An SRAM cell that may reduce or eliminate floating body effect when using a SOI and a method for fabricating the same are provided. A floating body of an access transistor of the SRAM is connected to a source region of a driver transistor, for example, through a body extension region extending from an active region. A silicide layer may be formed or a ground line contact may be over-etched to form a conductive contact plug that may provide a current path between the body exterior regions and the source region of the driver transistor.
    Type: Application
    Filed: July 6, 2006
    Publication date: November 2, 2006
    Inventors: Mu-Kyoung Jung, Young-Wug Kim, Hee-Sung Kang
  • Patent number: 7105900
    Abstract: An SRAM cell that may reduce or eliminate floating body effect when using a SOI and a method for fabricating the same are provided. A floating body of an access transistor of the SRAM is connected to a source region of a driver transistor, for example, through a body extension region extending from an active region. A silicide layer may be formed or a ground line contact may be over-etched to form a conductive contact plug that may provide a current path between the body exterior regions and the source region of the driver transistor.
    Type: Grant
    Filed: March 13, 2003
    Date of Patent: September 12, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Mu-Kyoung Jung, Young-Wug Kim, Hee-Sung Kang
  • Patent number: 7030022
    Abstract: Provided is a method of manufacturing a semiconductor device having a first region, in which a capacitance component is a dominant cause of a RC delay, and a second region, in which a resistance component is a dominant cause of a RC delay. The method comprises performing a first etching process to an insulating layer formed on a semiconductor substrate, so that a first trench having a first thickness and a second trench having the first thickness are formed in the first region and the second region, respectively; performing a second etching process to the second trench, so that a third trench having a second thickness thicker than the first thickness is formed in the second region; filling the first trench and the third trench with a metal layer; and removing portions of the metal layer, so that a first metal interconnection and a second metal interconnection are formed inside of the first trench and the third trench, respectively.
    Type: Grant
    Filed: September 4, 2003
    Date of Patent: April 18, 2006
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Mu-kyoung Jung, Kyung-tae Lee
  • Publication number: 20040238892
    Abstract: An SRAM cell that may reduce or eliminate floating body effect when using a SOI and a method for fabricating the same are provided. A floating body of an access transistor of the SRAM is connected to a source region of a driver transistor, for example, through a body extension region extending from an active region. A silicide layer may be formed or a ground line contact may be over-etched to form a conductive contact plug that may provide a current path between the body exterior regions and the source region of the driver transistor.
    Type: Application
    Filed: March 13, 2003
    Publication date: December 2, 2004
    Inventors: Mu-Kyoung Jung, Young-Wug Kim, Hee-Sung Kang
  • Publication number: 20040048476
    Abstract: Provided is a method of manufacturing a semiconductor device having a first region, in which a capacitance component is a dominant cause of a RC delay, and a second region, in which a resistance component is a dominant cause of a RC delay. The method comprises performing a first etching process to an insulating layer formed on a semiconductor substrate, so that a first trench having a first thickness and a second trench having the first thickness are formed in the first region and the second region, respectively; performing a second etching process to the second trench, so that a third trench having a second thickness thicker than the first thickness is formed in the second region; filling the first trench and the third trench with a metal layer; and removing portions of the metal layer, so that a first metal interconnection and a second metal interconnection are formed inside of the first trench and the third trench, respectively.
    Type: Application
    Filed: September 4, 2003
    Publication date: March 11, 2004
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Mu-Kyoung Jung, Kyung-Tae Lee