Patents by Inventor Mu-Liang Liao

Mu-Liang Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ALL-IN-ONE POLISHING PROCESS FOR A SEMICONDUCTOR WAFER
    Publication number: 20050159083
    Abstract: A semiconductor wafer has a top surface and an edge bevel surface, and a first material layer and a second material layer are respectively formed on the top surface and the edge bevel surface. A surface chemical mechanical polishing (surface CMP) process is performed to polish and remove portions of the first material layer down to a first thickness, and a rim CMP process is performed to completely remove the second material layer on the edge bevel surface down to the edge bevel surface thereafter to achieve a smooth surface of the edge bevel surface. Finally, a chemical cleaning process is performed to clean the edge bevel surface and the top surface, and the semiconductor wafer is dried thereafter.
    Type: Application
    Filed: January 16, 2004
    Publication date: July 21, 2005
    Inventors: Mu-Liang Liao, Chi-Piao Cheng, Te-Sung Hung, Yung-Chieh Kuo
  • All-in-one polishing process for a semiconductor wafer
    Patent number: 6913520
    Abstract: A semiconductor wafer has a top surface and an edge bevel surface, and a first material layer and a second material layer are respectively formed on the top surface and the edge bevel surface. A surface chemical mechanical polishing (surface CMP) process is performed to polish and remove portions of the first material layer down to a first thickness, and a rim CMP process is performed to completely remove the second material layer on the edge bevel surface down to the edge bevel surface thereafter to achieve a smooth surface of the edge bevel surface. Finally, a chemical cleaning process is performed to clean the edge bevel surface and the top surface, and the semiconductor wafer is dried thereafter.
    Type: Grant
    Filed: January 16, 2004
    Date of Patent: July 5, 2005
    Assignee: United Microelectronics Corp.
    Inventors: Mu-Liang Liao, Chi-Piao Cheng, Te-Sung Hung, Yung-Chieh Kuo