Abstract: The present invention pertains to an integrated surface-emitting optoelectronic module and the method for making the same. The yellow light procedure is performed to define a V-groove width for disposing an optical fiber on a silicon substrate. After dry etching a vertical groove, a dielectric layer is grown on the surface of the silicon substrate to protect the vertical wall, preventing the groove from getting wider due to subsequent wet etching. A 45-degree mirror surface is formed so that an optoelectronic device can be disposed on the mirror surface in the flip chip method. The optoelectronic module employs a complete silicon substrate to assemble a surface-emitting optoelectronic devices and an optical fiber by passive alignment, and therefore can be free from misalignment due to separate assembly.