Patents by Inventor Mu-Tsun Tseng
Mu-Tsun Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150281835Abstract: A voice coil adapted for an electricity-powered loudspeaker includes a plurality of coils formed by winding an enameled wire. The coils are stacked up and down to show a hollow multilayer structure with an accommodating space being formed therein. Each coil has two parallel and spaced straight-line segments, and two symmetrical arc segments oppositely connected between the two straight-line segments. A middle of the arc segment is arched outward. The center of each arc segment is located at another arc segment and the radius of each arc segment is greater than a spacing distance between the two straight-line segments to realize a biaxial voice coil.Type: ApplicationFiled: March 26, 2014Publication date: October 1, 2015Applicant: CHENG UEI PRECISION INDUSTRY CO., LTD.Inventors: Jiin Tarng Huang, Mu Tsun Tseng
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Publication number: 20150195638Abstract: An in-ear earphone includes an earcap, a loudspeaker module and a rear housing. The earcap has a hollow cap portion, and a front housing integrally molded to a front of an inside surface of the cap portion. The cap portion defines a sound hole. The front housing includes a hollow connecting tube protruded rearward from the front of the inside surface of the cap portion and projecting inside of the cap portion, and a hollow sleeve spread outward and then extended rearward from a free end of the connecting tube. The sleeve defines an accommodating space of which one end is communicated with an inside of the hollow connecting tube and the other end is communicated with an outside. The loudspeaker module is accommodated in the accommodating space of the sleeve. The rear housing is covered to a rear of the sleeve of the earcap.Type: ApplicationFiled: January 3, 2014Publication date: July 9, 2015Applicant: Cheng Uei Precision Industry Co., Ltd.Inventor: Mu Tsun Tseng
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Patent number: 8565467Abstract: An earphone includes a front housing, a tuning element, a rear housing and a loudspeaker. The front housing has a hollow sound tube, a sealed cover and a sealed barrel. The sealed cover defines a tuning hole. The sealed barrel defines a leaking hole connecting between the tuning hole and an external space of the earphone. The tuning element rotatably mounted to the front housing has a tuning pillar inserted in the tuning hole. The tuning pillar defines a tuning fillister. The rear housing is assembled forward to the front housing for locating the loudspeaker between the front housing and the rear housing. A sound cavity is formed among the front housing, the rear housing and the loudspeaker, and is communicated with the tuning fillister. A relative position of the tuning fillister and the leaking hole is capable of being modulated by means of rotating the tuning element.Type: GrantFiled: March 30, 2012Date of Patent: October 22, 2013Assignee: Cheng Uei Precision Industry Co., Ltd.Inventor: Mu-Tsun Tseng
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Publication number: 20130259287Abstract: An earphone includes a front housing, a tuning element, a rear housing and a loudspeaker. The front housing has a hollow sound tube, a sealed cover and a sealed barrel. The sealed cover defines a tuning hole. The sealed barrel defines a leaking hole connecting between the tuning hole and an external space of the earphone. The tuning element rotatably mounted to the front housing has a tuning pillar inserted in the tuning hole. The tuning pillar defines a tuning fillister. The rear housing is assembled forward to the front housing for locating the loudspeaker between the front housing and the rear housing. A sound cavity is formed among the front housing, the rear housing and the loudspeaker, and is communicated with the tuning fillister. A relative position of the tuning fillister and the leaking hole is capable of being modulated by means of rotating the tuning element.Type: ApplicationFiled: March 30, 2012Publication date: October 3, 2013Inventor: Mu-Tsun Tseng
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Patent number: 8422717Abstract: Provided is an adjustable audio headphone, including a headphone body, a damping object and a pressing mechanism. The headphone body includes a headphone shell, which forms a sound cavity in inside thereof and a receiving chamber on one end thereof. A bottom surface of the receiving chamber forms a through hole communicated with the sound cavity. The damping object is made of compressible material such as sponge, elastic plastic, textile and so on and. The damping object is placed into the receiving chamber of the headphone shell. The pressing mechanism is mounted on the headphone shell and is capable of pressing the damping object. The adjustable audio headphone of the present invention can compress the damping object to change the density of the damping object by employing the pressing mechanism, thereby varying the pressure of the sound cavity and realizing the object of adjusting the audio thereof.Type: GrantFiled: October 19, 2010Date of Patent: April 16, 2013Assignee: Cheng Uei Precision Industry Co., Ltd.Inventors: You-ruei Lin, Chun-hung Chen, Meng-ching Cho, Mu-tsun Tseng
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Patent number: 8406448Abstract: Provided is an earphone, including an earphone body and an earphone cap. The earphone body includes an earphone shell forming a sound cavity and disposing a sound-guiding pipe. The sound-guiding pipe disposes at least one through hole. The earphone cap is rotatably mounted on the earphone body and includes a main body and a barrel. The barrel is located on the inside of the main body and arranged to encompass the sound-guiding pipe. The barrel disposes at least one opening, which is arranged to be aligned or misaligned with the part or whole of the through hole. The earphone of the present invention can make the opening be aligned or misaligned with and the part or whole of the through hole by rotating the earphone cap, thereby varying the pressure of the sound cavity to attain the object of adjusting sound effect.Type: GrantFiled: October 19, 2010Date of Patent: March 26, 2013Assignee: Cheng Uei Precision Industry Co., Ltd.Inventors: You-ruei Lin, Chun-hung Chen, Mu-tsun Tseng
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Patent number: 8391538Abstract: An earphone includes a basket defining a through hole. A leading wire board fixed underneath the basket has a pair of solder foils on a bottom surface thereof. A magnet unit is located in the basket with the through hole adjacent to a side edge of the magnet unit. A diaphragm is arranged on the basket and over the magnet unit. A voice coil is fixed to a bottom of the diaphragm and surrounding the magnet unit. The voice coil has two leading wires. Each leading wire passes through the through hole of the basket and further bends to solder with the corresponding solder foils of the leading wire board.Type: GrantFiled: December 20, 2010Date of Patent: March 5, 2013Assignee: Cheng Uei Precision Industry Co., Ltd.Inventors: Chun-Ching Chiu, Mu-Tsun Tseng
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Patent number: 8391532Abstract: An in-ear earphone has a shell including an upper shell and a lower shell cooperating with the upper shell to define a resonance space for receiving a loudspeaker. A plurality of damping objects are made of different elastic and compressible materials. A group of first adjusting elements are capable of being replaceablely assembled to the lower shell for receiving external sound signals. Each first adjusting element defines a receiving fillister and a sound hole connected with the receiving fillister. Each first adjusting element has one damping object disposed in the receiving fillister and further disposed between the sound hole and the resonance space. A group of second adjusting elements are capable of being replaceablely assembled to the upper shell for transmitting the sound signals out. Each second adjusting element defines a receiving cavity for receiving one of the damping objects therein and makes it face to the resonance space.Type: GrantFiled: January 7, 2011Date of Patent: March 5, 2013Assignee: Cheng Uei Precision Industry Co., Ltd.Inventors: Chun-Ching Chiu, Mu-Tsun Tseng
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Publication number: 20120177241Abstract: An in-ear earphone has a shell including an upper shell and a lower shell cooperating with the upper shell to define a resonance space for receiving a loudspeaker. A plurality of damping objects are made of different elastic and compressible materials. A group of first adjusting elements are capable of being replaceablely assembled to the lower shell for receiving external sound signals. Each first adjusting element defines a receiving fillister and a sound hole connected with the receiving fillister. Each first adjusting element has one damping object disposed in the receiving fillister and further disposed between the sound hole and the resonance space. A group of second adjusting elements are capable of being replaceablely assembled to the upper shell for transmitting the sound signals out. Each second adjusting element defines a receiving cavity for receiving one of the damping objects therein and makes it face to the resonance space.Type: ApplicationFiled: January 7, 2011Publication date: July 12, 2012Applicant: CHENG UEI PRECISION INDUSTRY CO., LTD.Inventors: Chun-Ching Chiu, Mu-Tsun Tseng
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Publication number: 20120155690Abstract: An earphone includes a basket defining a through hole. A leading wire board fixed underneath the basket has a pair of solder foils on a bottom surface thereof. A magnet unit is located in the basket with the through hole adjacent to a side edge of the magnet unit. A diaphragm is arranged on the basket and over the magnet unit. A voice coil is fixed to a bottom of the diaphragm and surrounding the magnet unit. The voice coil has two leading wires. Each leading wire passes through the through hole of the basket and further bends to solder with the corresponding solder foils of the leading wire board.Type: ApplicationFiled: December 20, 2010Publication date: June 21, 2012Inventors: Chun-Ching Chiu, Mu-Tsun Tseng
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Publication number: 20120093332Abstract: Provided is an adjustable audio headphone, including a headphone body, a damping object and a pressing mechanism. The headphone body includes a headphone shell, which forms a sound cavity in inside thereof and a receiving chamber on one end thereof. A bottom surface of the receiving chamber forms a through hole communicated with the sound cavity. The damping object is made of compressible material such as sponge, elastic plastic, textile and so on and. The damping object is placed into the receiving chamber of the headphone shell. The pressing mechanism is mounted on the headphone shell and is capable of pressing the damping object. The adjustable audio headphone of the present invention can compress the damping object to change the density of the damping object by employing the pressing mechanism, thereby varying the pressure of the sound cavity and realizing the object of adjusting the audio thereof.Type: ApplicationFiled: October 19, 2010Publication date: April 19, 2012Applicant: Cheng Uei Precision Industry Co., LTD.Inventors: YOU-RUEI LIN, Chun-hung Chen, Meng-ching Cho, Mu-tsun Tseng
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Publication number: 20120093331Abstract: Provided is an earphone, including an earphone body and an earphone cap. The earphone body includes an earphone shell forming a sound cavity and disposing a sound-guiding pipe. The sound-guiding pipe disposes at least one through hole. The earphone cap is rotatably mounted on the earphone body and includes a main body and a barrel. The barrel is located on the inside of the main body and arranged to encompass the sound-guiding pipe. The barrel disposes at least one opening, which is arranged to be aligned or misaligned with the part or whole of the through hole. The earphone of the present invention can make the opening be aligned or misaligned with and the part or whole of the through hole by rotating the earphone cap, thereby varying the pressure of the sound cavity to attain the object of adjusting sound effect.Type: ApplicationFiled: October 19, 2010Publication date: April 19, 2012Applicant: Cheng Uei Precision Industry Co., LTD.Inventors: YOU-RUEI LIN, Chun-hung Chen, Mu-tsun Tseng
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Patent number: D538228Type: GrantFiled: May 18, 2006Date of Patent: March 13, 2007Assignee: Cheng Uei Precision Industry Co., Ltd.Inventors: Yao-Ting Wang, Mu-Tsun Tseng