Abstract: An IC testing apparatus whereby a wedge body with inclined surfaces is attached to a bottom side of existing contact finger modules. The inclined support is then attached to the top of a load board of the testing apparatus. The inclined surfaces cause the normally horizontal finger modules to become inclined to the horizontal. In this manner, testing can be carried out in the usual way with existing contact finger modules, whilst the problems of IC device contact pad burr and oxidization are solved. Furthermore, because the outer, load board end of the contact fingers are also at an angle, these outer tips of the contact fingers naturally come into contact with the load board, without requiring any soldering.

Abstract: An electrical contact assembly having a pair of contacts mirroring each other, each contact coupled with an elastomer positioned in a recess formed near a lower end of the contact. Each elastomer has a cylindrical shape with the axis of the cylinder running in a front to rear direction. Each elastomer is secured at its front and rear ends by a lower cavity formed within a housing. The contacts are able to rock sideways around their lower ends between uncompressed and compressed states.

Abstract: An electrical contact assembly having a pair of contacts mirroring each other, each contact coupled with an elastomer positioned in a recess formed near a lower end of the contact. Each elastomer has a cylindrical shape with the axis of the cylinder running in a front to rear direction. Each elastomer is secured at its front and rear ends by a lower cavity formed within a housing. The contacts are able to rock sideways around their lower ends between uncompressed and compressed states.

Abstract: A chip testing solution having two separate contacts: one to provide current and one to measure voltage. One contact acts as the force and other as sense, and with its unique short wipe stroke technology enables the electrical connection from the contact terminal of the device under test (DUT) to the loadboard without fail even after prolonged insertion/testing of the devices. The two contacts are in close proximity, but electrically isolated from each other. Each contact is made to electrically touch a single conductive lead/pad on the DUT thus forming a test connection. The two contacts; one on front and other on back, wiping on the lead/pads will generally be a “sense” probe, and a “force” used for making a Kelvin connection. The short contact is connected to the loadboard by means of an additional contact known as “interposer” extending through and top of the tall contact base body.

Abstract: A chip testing solution having two separate contacts: one to provide current and one to measure voltage. One contact acts as the force and other as sense, and with its unique short wipe stroke technology enables the electrical connection from the contact terminal of the device under test (DUT) to the loadboard without fail even after prolonged insertion/testing of the devices. The two contacts are in close proximity, but electrically isolated from each other. Each contact is made to electrically touch a single conductive lead/pad on the DUT thus forming a test connection. The two contacts; one on front and other on back, wiping on the lead/pads will generally be a “sense” probe, and a “force” used for making a Kelvin connection. The short contact is connected to the loadboard by means of an additional contact known as “interposer” extending through and top of the tall contact base body.