Patents by Inventor Muhammad Faisal Khan

Muhammad Faisal Khan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Selective removal of gold from a lead frame
    Patent number: 8114706
    Abstract: A method of packaging an integrated circuit, including providing a lead frame having lead fingers, where the lead frame has a gold layer thereon on a top surface and a bottom surface. An integrated circuit die is attached to the lead frame. The gold layer is substantially removed from portions of the top surface of the lead frame. The integrated circuit die is wire bonded to the lead fingers with a plurality of wire stitches subsequent to substantially removing the gold. The die is encapsulated in a mold compound to form a packaged integrated circuit.
    Type: Grant
    Filed: April 27, 2011
    Date of Patent: February 14, 2012
    Assignee: Texas Instruments Incorporated
    Inventors: Takahiko Kudoh, Muhammad Faisal Khan
  • Selective Removal of Gold From a Lead Frame
    Publication number: 20110201158
    Abstract: A method of packaging an integrated circuit, including providing a lead frame having lead fingers, where the lead frame has a gold layer thereon on a top surface and a bottom surface. An integrated circuit die is attached to the lead frame. The gold layer is substantially removed from portions of the top surface of the lead frame. The integrated circuit die is wire bonded to the lead fingers with a plurality of wire stitches subsequent to substantially removing the gold. The die is encapsulated in a mold compound to form a packaged integrated circuit.
    Type: Application
    Filed: April 27, 2011
    Publication date: August 18, 2011
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Takahiko KUDOH, Muhammad Faisal KHAN
  • Packaged integrated circuit having gold removed from a lead frame
    Patent number: 7956445
    Abstract: A method of packaging an integrated circuit, including providing a lead frame having lead fingers, where the lead frame has a gold layer thereon on a top surface and a bottom surface. An integrated circuit die is attached to the lead frame. The gold layer is substantially removed from portions of the top surface of the lead frame. The integrated circuit die is wire bonded to the lead fingers with a plurality of wire stitches subsequent to substantially removing the gold. The die is encapsulated in a mold compound to form a packaged integrated circuit.
    Type: Grant
    Filed: August 15, 2006
    Date of Patent: June 7, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Takahiko Kudoh, Muhammad Faisal Khan
  • SELECTIVE REMOVAL OF GOLD FROM A LEAD FRAME
    Publication number: 20080044952
    Abstract: A method of packaging an integrated circuit, including providing a lead frame having lead fingers, where the lead frame has a gold layer thereon on a top surface and a bottom surface. An integrated circuit die is attached to the lead frame. The gold layer is substantially removed from portions of the top surface of the lead frame. The integrated circuit die is wire bonded to the lead fingers with a plurality of wire stitches subsequent to substantially removing the gold. The die is encapsulated in a mold compound to form a packaged integrated circuit.
    Type: Application
    Filed: August 15, 2006
    Publication date: February 21, 2008
    Applicant: Texas Instruments Incorporated
    Inventors: Takahiko Kudoh, Muhammad Faisal Khan