Abstract: A power module is provided and includes first stack, second stack, and third stacks of layers, a heat pipe, and at least one cold plate or heat sink. The third stack of layers is disposed between the first and second stacks of layers and includes a first semiconductor die, a second semiconductor die and a center spacer layer disposed between the first semiconductor die and the second semiconductor die. The heat pipe extends at least partially into the center spacer layer. The at least one cold plate or heat sink receives thermal energy from the first stack of layers and the second stack of layers. The first stack of layers, the second stack of layers, the third stack of layers, the heat pipe and the at least one cold plate or heat sink facilitate dual sided cooling of each of the first semiconductor die and the second semiconductor die.

Abstract: An electronic solid-state switch assembly includes a base plate and a heat exchanger; an electrically insulating layer and a direct bonded substrate affixed to the base plate; a first terminal and a second terminal; a plurality of power transistors; a plurality of gate drivers; a communication interface, a current sensor, and a snubber circuit; and a controller. The plurality of gate drivers are operatively coupled to the plurality of power transistors. The plurality of power transistors are arranged in parallel on the direct bonded substrate between the first terminal and the second terminal. The plurality of power transistors are electrically connected to the first terminal and to the second terminal. The controller is in communication with the plurality of gate drivers, the current sensor, and the communication interface. The controller is configured to control, via the plurality of gate drivers, the plurality of power transistors.

Abstract: A planar power module includes a second substrate arranged parallel to a first substrate, with the substrates respectively having a dielectric layer interposed between two conductive layers, such that one of the conductive layers of each substrate together forms parallel external conductive surfaces of the power module. The power module includes direct current (DC) bus bars, alternating current (AC) bus bars, and semiconductor switching dies arranged between the substrates. The dies are electrically connected to the bus bars, with each respective die electrically connected to a conductive layers of the first or second substrates. A polymer molding material partially surrounds the substrates and the switching dies. An electric powertrain system includes an electric machine, a propulsion battery pack, and a traction power inverter module (TPIM) having the power module. The power module is a three-phase full-bridge inverter circuit. An electric powertrain and motor vehicle use the power module.

Abstract: An electronic solid-state switch assembly includes a base plate and a heat exchanger; an electrically insulating layer and a direct bonded substrate affixed to the base plate; a first terminal and a second terminal; a plurality of power transistors; a plurality of gate drivers; a communication interface, a current sensor, and a snubber circuit; and a controller. The plurality of gate drivers are operatively coupled to the plurality of power transistors. The plurality of power transistors are arranged in parallel on the direct bonded substrate between the first terminal and the second terminal. The plurality of power transistors are electrically connected to the first terminal and to the second terminal. The controller is in communication with the plurality of gate drivers, the current sensor, and the communication interface. The controller is configured to control, via the plurality of gate drivers, the plurality of power transistors.

Abstract: A solid-state fuse device includes a switch a gate driver connected to the switch and configured to transition the switch from a closed state to an open state when at least one of an overcurrent measurement exceeds a predetermined overcurrent threshold or a voltage drop across the switch exceeds a predetermined saturation voltage threshold.

Abstract: A bi-directional solid state switch includes: a first bus bar; a second bus bar; a first solid state switch implemented on a first printed circuit board (PCB), the first solid state switch including: a first control terminal; a first terminal electrically connected to the first bus bar; and a second terminal; and a second solid state switch implemented on a second PCB, the second solid state switch including: a second control terminal; a third terminal electrically connected to the second terminal of the first solid state switch; and a fourth terminal electrically connected to the second bus bar.

Abstract: A busbar assembly includes a base having a width and a length. The base has a first surface and a second surface and has a first side and a second side. A distance between the first side and the second side comprises the width, and the base defines a slot centered between approximately 75% and approximately 79% of the width.

Abstract: An electric machine disposed within a housing includes a stator, a rotor, and one or more point field detectors. The stator receives current from an inverter. The rotor is connected to and rotating a shaft based on a magnetic field generated by the stator. The one or more point field detectors are configured to detect leakage flux within the housing. The stator, the rotor and the one or more point field detectors are disposed within the housing.

Abstract: A current source inverter includes a first phase leg including a plurality of switching devices, a second phase leg including a plurality of switching devices, and a third phase leg including a plurality of switching devices. The current source inverter also includes a zero-state phase leg including at least one switching device, wherein the zero-state phase leg is configured to transition from an open state to prevent current flow to a closed state to allow current flow between a positive and negative terminal during a dead-band time.

Abstract: A motor control system includes: a d-q target module configured to, based on a target torque of an electric motor, determine a first target d-axis current and a first target q-axis current; an offset module configured to, based on a capacitor current through capacitors connected across phases of the electric motor, determine a d-axis current offset and a q-axis current offset; an adder module configured to determine a second target d-axis current based on a sum of the first target d-axis current and the d-axis current offset and to determine a second target q-axis current based on a sum of the first target q-axis current and the q-axis current offset; and a driver module configured to, based on the second target d-axis current and the second target q-axis current, switch switches of a current source inverter (CSI) module configured to apply power to the phases of the electric motor.

Abstract: A solid-state fuse device includes a switch a gate driver connected to the switch and configured to transition the switch from a closed state to an open state when at least one of an overcurrent measurement exceeds a predetermined overcurrent threshold or a voltage drop across the switch exceeds a predetermined saturation voltage threshold.

Abstract: A power module is provided and includes first stack, second stack, and third stacks of layers, a heat pipe, and at least one cold plate or heat sink. The third stack of layers is disposed between the first stack of layers and the second stack of layers and includes a first semiconductor die, a second semiconductor die and a center spacer layer disposed between the first semiconductor die and the second semiconductor die. The heat pipe extends at least partially into the center spacer layer. The at least one cold plate or heat sink receives thermal energy from the first stack of layers and the second stack of layers. The second stack of layers, the third stack of layers, the heat pipe and the at least one cold plate or heat sink facilitate dual sided cooling of each of the first semiconductor die and the second semiconductor die.

Abstract: A busbar assembly includes a base having a width and a length. The base has a first surface and a second surface and has a first side and a second side. A distance between the first side and the second side comprises the width, and the base defines a slot centered between approximately 75% and approximately 79% of the width.

Abstract: An electric machine disposed within a housing includes a stator, a rotor, and one or more point field detectors. The stator receives current from an inverter. The rotor is connected to and rotating a shaft based on a magnetic field generated by the stator. The one or more point field detectors are configured to detect leakage flux within the housing. The stator, the rotor and the one or more point field detectors are disposed within the housing.

Abstract: A motor control system includes: a d-q target module configured to, based on a target torque of an electric motor, determine a first target d-axis current and a first target q-axis current; an offset module configured to, based on a capacitor current through capacitors connected across phases of the electric motor, determine a d-axis current offset and a q-axis current offset; an adder module configured to determine a second target d-axis current based on a sum of the first target d-axis current and the d-axis current offset and to determine a second target q-axis current based on a sum of the first target q-axis current and the q-axis current offset; and a driver module configured to, based on the second target d-axis current and the second target q-axis current, switch switches of a current source inverter (CSI) module configured to apply power to the phases of the electric motor.

Abstract: A current source inverter includes a first phase leg including a plurality of switching devices, a second phase leg including a plurality of switching devices, and a third phase leg including a plurality of switching devices. The current source inverter also includes a zero-state phase leg including at least one switching device, wherein the zero-state phase leg is configured to transition from an open state to prevent current flow to a closed state to allow current flow between a positive and negative terminal during a dead-band time.

Abstract: A busbar assembly includes a base having a width and a length. The base has a first surface and a second surface and has a first side and a second side. A distance between the first side and the second side comprises the width, and the base defines a slot centered between approximately 75% and approximately 79% of the width.

Abstract: A busbar assembly includes a base having a width and a length. The base has a first surface and a second surface and has a first side and a second side. A distance between the first side and the second side comprises the width, and the base defines a slot centered between approximately 75% and approximately 79% of the width.

Abstract: A planar power module includes a second substrate arranged parallel to a first substrate, with the substrates respectively having a dielectric layer interposed between two conductive layers, such that one of the conductive layers of each substrate together forms parallel external conductive surfaces of the power module. The power module includes direct current (DC) bus bars, alternating current (AC) bus bars, and semiconductor switching dies arranged between the substrates. The dies are electrically connected to the bus bars, with each respective die electrically connected to a conductive layers of the first or second substrates. A polymer molding material partially surrounds the substrates and the switching dies. An electric powertrain system includes an electric machine, a propulsion battery pack, and a traction power inverter module (TPIM) having the power module. The power module is a three-phase full-bridge inverter circuit. An electric powertrain and motor vehicle use the power module.

Abstract: A bi-directional solid state switch includes: a first bus bar; a second bus bar; a first solid state switch implemented on a first printed circuit board (PCB), the first solid state switch including: a first control terminal; a first terminal electrically connected to the first bus bar; and a second terminal; and a second solid state switch implemented on a second PCB, the second solid state switch including: a second control terminal; a third terminal electrically connected to the second terminal of the first solid state switch; and a fourth terminal electrically connected to the second bus bar.