Abstract: A multi-sensor system for monitoring water parameters, the system including a first metallic layer; a dielectric layer formed on the first metallic layer; a second metallic layer formed on the dielectric layer; a power source electrically connected to the second metallic layer; a computing device electrically connected to the second metallic layer; and a stretchable outer layer that encapsulates the first metallic layer, the dielectric layer, the second metallic layer, the power source and the computing device. The multi-sensor system is stretchable and flexible.

Abstract: High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.

Abstract: Various examples are provided for stretchable antennas that can be used for applications such as wearable electronics. In one example, a stretchable antenna includes a flexible support structure including a lateral spring section having a proximal end and at a distal end; a metallic antenna disposed on at least a portion of the lateral spring section, the metallic antenna extending along the lateral spring section from the proximal end; and a metallic feed coupled to the metallic antenna at the proximal end of the lateral spring section. In another example, a method includes patterning a polymer layer disposed on a substrate to define a lateral spring section; disposing a metal layer on at least a portion of the lateral spring section, the metal layer forming an antenna extending along the portion of the lateral spring section; and releasing the polymer layer and the metal layer from the substrate.

Abstract: A three-dimensional structure may be obtained from a two-dimensional thin film by applying a stressor layer to the two-dimensional thin film and releasing the thin film from a support substrate. Such a three-dimensional structure may include a thermoelectric responsive material for forming a thermoelectric generator (TEG). A manufacturing process for the transformation from 2-D to 3-D may use a polymer stressor layer deposited on the thermoelectric responsive thin film. The combination thermoelectric responsive layer and stressor layer can be released from a carrier, after which the stressor layer causes the thermoelectric responsive layer to curl. The curl can cause the thermoelectric responsive layer to roll up during the release from the carrier to form a tubular structure.

Abstract: An apparatus for personal health maintenance has a sensor attached at least indirectly to a carrier member in turn attachable to a user or subject and configured for measurement of at least one physiological parameter of the user. A reservoir contains a preselected composition. An electronic processor is operatively connected to the sensor for receiving a signal therefrom encoding a measurement of the physiological parameter, the processor being configured for determining a divergence of the physiological parameter from a predetermined magnitude, the processor being operatively connected to a dispensing mechanism for ejecting, from the reservoir, an amount of the composition to be administered to the user to reduce divergence of the physiological parameter from the predetermined magnitude. The dispensing mechanism includes an expandable polymer composite layer with gas-filled micro-bubbles or microspheres expandable by operation of a heating element.

Abstract: One manner of producing more desirable clothing with electronic capabilities is to manufacture electronics, such as the charging wires or devices themselves, directly onto the textile materials. Textile materials generally do not support the manufacturing of electronic devices, in part because the surface of the textile is too rough for electronic devices or the processes used to manufacture electronic devices. An intermediate layer may be placed on the textile material to reduce the roughness of the surface of the textile material and provide other beneficial characteristics for the placement of electronic devices directly on the textile material.

Abstract: Various examples are related to parking management, including identifying and reserving empty parking spaces. In one example, a smart parking space system includes a parking controller located at a parking space. The parking controller can identify a vehicle located at the parking space via an input sensor or a transceiver that initiates wireless communication with an electronic tag associated with the vehicle; and communicate a parking vacancy associated with the parking space to a remote computing device based at least in part on the identification of the vehicle. In another example, a computing device can receive parking vacancy data associated with a parking space from a parking controller; determine a parking vacancy associated with the parking space using the parking vacancy data; and encode for display on a client device a network page that includes an indication of the parking vacancy associated with the parking space.

Abstract: An out-of-plane deformable semiconductor substrate includes a plurality of rigid portions having a first thickness and an out-of-plane deformable portion having a second thickness and connecting the plurality of rigid portions to each other. The second thickness is smaller than the first thickness. The out-of-plane deformable semiconductor substrate is monolithic.

Abstract: A method of fabricating a thermal management device. The method includes depositing a seed layer, using a seed layer depositing technique, on a side of a support base; growing a heat sink base layer on a side of the seed layer; depositing a hard mask on a side of the support base directly opposite that containing the seed and heat sink base layers; patterning the hard mask with a photoresist mask; etching the patterned hard mask with an etching technique, wherein the etching creates trenches in the underlying support base, exposing the seed layer; removing the hard mask with a hard mask removal technique; depositing a layer of photoresist on the heat sink base layer; growing heat sinks using a heat sink growth technique on the exposed seed layer; removing the photoresist layer with a photoresist layer removal technique; and removing the support base with a support base removal technique.

Abstract: An activable electronic component destruction device includes a heater and a heat-activated expandable material arranged on top of the heater. Heating of the heater causes the heat-activated expandable material to expand. The device further includes activation electronics coupled to the heater. The activation electronics are configured to control supply of power to the heater, which causes the heater to heat the heat-activated expandable material, which breaks a semiconductor substrate arranged on top of the heat-activated expandable material.

Abstract: High performance complementary metal oxide semiconductor (CMOS) electronics are critical for any full-fledged electronic system. However, state-of-the-art CMOS electronics are rigid and bulky making them unusable for flexible electronic applications. While there exist bulk material reduction methods to flex them, such thinned CMOS electronics are fragile and vulnerable to handling for high throughput manufacturing. Here, we show a fusion of a CMOS technology compatible fabrication process for flexible CMOS electronics, with inkjet and conductive cellulose based interconnects, followed by additive manufacturing (i.e. 3D printing based packaging) and finally roll-to-roll printing of packaged decal electronics (thin film transistors based circuit components and sensors) focusing on printed high performance flexible electronic systems. This work provides the most pragmatic route for packaged flexible electronic systems for wide ranging applications.

Abstract: Various examples are provided for stretchable antennas that can be used for applications such as wearable electronics. In one example, a stretchable antenna includes a flexible support structure including a lateral spring section having a proximal end and at a distal end; a metallic antenna disposed on at least a portion of the lateral spring section, the metallic antenna extending along the lateral spring section from the proximal end; and a metallic feed coupled to the metallic antenna at the proximal end of the lateral spring section. In another example, a method includes patterning a polymer layer disposed on a substrate to define a lateral spring section; disposing a metal layer on at least a portion of the lateral spring section, the metal layer forming an antenna extending along the portion of the lateral spring section; and releasing the polymer layer and the metal layer from the substrate.

Abstract: A CMOS technology-compatible fabrication process for flexible CMOS electronics embedded during additive manufacturing (i.e. 3D printing). A method for such a process may include printing a first portion of a 3D structure; pausing the step of printing the 3D structure to embed the flexible silicon substrate; placing the flexible silicon substrate in a cavity of the first portion of the 3D structure to embed the flexible silicon substrate in the 3D structure; and resuming the step of printing the 3D structure to form the second portion of the 3D structure.

Abstract: Electronic stickers may be manufactured on flexible substrates as layers and packaged together. The package may then have an adhesive applied to one side to provide capability for sticking the electronic devices to surfaces. The stickers can be wrappable, placed on surfaces, glued on walls or mirrors or wood or stone, and have electronics which may or may not be ultrathin. Packaging for the electronic sticker can use polymer on cellulose manufacturing and/or three dimensional (3-D) printing. The electronic stickers may provide lighting capability, sensing capability, and/or recharging capabilities.

Abstract: A flexible and non-functionalized low cost paper-based electronic system platform fabricated from common paper, such as paper based sensors, and methods of producing paper based sensors, and methods of sensing using the paper based sensors are provided. A method of producing a paper based sensor can include the steps of: a) providing a conventional paper product to serve as a substrate for the sensor or as an active material for the sensor or both, the paper product not further treated or functionalized; and b) applying a sensing element to the paper substrate, the sensing element selected from the group consisting of a conductive material, the conductive material providing contacts and interconnects, sensitive material film that exhibits sensitivity to pH levels, a compressible and/or porous material disposed between a pair of opposed conductive elements, or a combination of two of more said sensing elements.

Abstract: Flexible and foldable paper-substrate thermoelectric generators (TEGs) and methods for making the paper-substrate TEGs are disclosed. A method includes depositing a plurality of thermocouples in series on a paper substrate to create a paper-substrate TEG, wherein the plurality of thermocouples is deposited between two contact points of the paper-substrate TEG. The method may also include setting the power density and maximum achievable temperature gradient of the paper-substrate TEG by folding the paper-substrate TEG. A paper-substrate TEG apparatus may include a paper substrate and a plurality of thermocouples deposited in series on the paper substrate between two contact points of the paper-substrate TEG, wherein the power density and maximum achievable temperature gradient of the paper-substrate TEG is set by folding the paper-substrate TEG.

Abstract: A smart thermal patch for adaptive thermotherapy is provided. In an embodiment, the patch can be a stretchable, non-polymeric, conductive thin film flexible and non-invasive body integrated mobile thermal heater with wireless control capabilities that can be used to provide adaptive thermotherapy. The patch can be geometrically and spatially tunable on various pain locations. Adaptability allows the amount of heating to be tuned based on the temperature of the treated portion.

Abstract: Methods for fabricating nanoscale features are disclosed. One technique involves depositing onto a substrate, where the first layer may be a silicon layer and may subsequently be etched. A second layer and third layer may be deposited on the etch first layer, followed by the deposition of a silicon cap. The second and third layer may be etched, exposing edges of the second and third layers. The cap and first layer may be removed and either the second or third layer may be etched, creating a nanoscale pattern.

Abstract: Methods for fabricating nanoscale features are disclosed. One technique involves depositing onto a substrate, where the first layer may be a silicon layer and may subsequently be etched. A second layer and third layer may be deposited on the etch first layer, followed by the deposition of a silicon cap. The second and third layer may be etched, exposing edges of the second and third layers. The cap and first layer may be removed and either the second or third layer may be etched, creating a nanoscale pattern.