Abstract: A composition of solid particles comprising substantially inorganic, electronically conductive particles and fluoropolymer particles, wherein the fluoropolymer is melt-processable and has a melting point between 100° C. and 325° C. and a melt flow index at 372° C. and at 5 kg load (MFI 372/5) of at least 0.1 and up to 100 g/10 min, and wherein the fluoropolymer particles have a particle size of less than 500 nm and wherein the particles comprising the substantially inorganic, electronically conductive material is present in the form of particles having a particle size of less than 15,000 ?m, and methods for producing such compositions and articles containing such compositions.

Abstract: A composition of solid particles comprising substantially inorganic, electronically conductive particles and fluoropolymer particles, wherein the fluoropolymer is melt-processable and has a melting point between 100° C. and 325° C. and a melt flow index at 372° C. and at 5 kg load (MFI 372/5) of at least 0.1 and up to 100 g/10 min, and wherein the fluoropolymer particles have a particle size of less than 500 nm and wherein the particles comprising the substantially inorganic, electronically conductive material is present in the form of particles having a particle size of less than 15,000 ?m, and methods for producing such compositions and articles containing such compositions.

Abstract: Described herein is a radiation shielding composition and a method for making comprising: (i) a boron-containing powder wherein the boron-containing powder comprises at least a bimodal particle size distribution, and (ii) a metal, wherein the metal encapsulates the ceramic powder to form the radiation shielding composition.

Abstract: An article that includes a substrate and an amorphous, covalently-bonded layer on the surface of the substrate. The substrate may be a crystalline ceramic and/or may have a surface with a first surface roughness (Ra) of at least 100 angstroms, and the amorphous, covalently-bonded layer has a second surface roughness (Ra) of up to 15 angstroms. The substrate may have a dimension of at least 50 mm, and the amorphous, covalently-bonded layer may have a thickness of at least five micrometers. A method of making an article is also disclosed. The method includes forming an amorphous, covalently-bonded layer on the surface of the substrate by plasma deposition and, in some embodiments, polishing the amorphous, covalently-bonded layer to a second surface roughness (Ra) of up to 15 angstroms. The amorphous, covalently-bonded layer in the article and method includes silicon, oxygen, carbon, and hydrogen atoms.