Patents by Inventor Muhammat Sanusi MUHAMMAD

Muhammat Sanusi MUHAMMAD has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
    Publication number: 20210313294
    Abstract: A semiconductor package includes a carrier having a recess, a semiconductor die arranged on the carrier such that a first side of the semiconductor die faces the carrier, and a contact clip arranged over a second side of the semiconductor die, opposite the first side. The contact clip includes a lowered part. The lowered part is arranged in the recess.
    Type: Application
    Filed: March 24, 2021
    Publication date: October 7, 2021
    Inventors: Chau Fatt Chiang, Xavier Arokiasamy, Naveendran Chellamuthu, Chee Chiew Chong, Joo Ming Goa, Chee Hong Lee, Muhammat Sanusi Muhammad, Chee Voon Tan, Wee Boon Tay
  • Semiconductor package and method for fabricating a semiconductor package
    Patent number: 10490470
    Abstract: A method of fabricating a semiconductor package comprises providing a carrier, fabricating an opening in the carrier, attaching a semiconductor chip to the carrier and fabricating an encapsulation body covering the semiconductor chip.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: November 26, 2019
    Assignee: Infineon Technologies AG
    Inventors: Hock Heng Chong, Sook Woon Chan, Chau Fatt Chiang, Khar Foong Chung, Chee Hong Fang, Muhammat Sanusi Muhammad, Mei Chin Ng, Yean Seng Ng, Pei Luan Pok, Choon Huey Wang
  • Semiconductor package and method for fabricating a semiconductor package
    Publication number: 20180174935
    Abstract: A method of fabricating a semiconductor package comprises providing a carrier, fabricating an opening in the carrier, attaching a semiconductor chip to the carrier and fabricating an encapsulation body covering the semiconductor chip.
    Type: Application
    Filed: December 12, 2017
    Publication date: June 21, 2018
    Inventors: Hock Heng CHONG, Sook Woon CHAN, Chau Fatt CHIANG, Khar Foong CHUNG, Chee Hong FANG, Muhammat Sanusi MUHAMMAD, Mei Chin NG, Yean Seng NG, Pei Luan POK, Choon Huey WANG