Abstract: Lamp assembly with thermal transporter. The present disclosure includes disclosure of a lamp assembly, comprising a housing; a cover attached to the housing defining a volume; a light source disposed within the volume; and a thermal transporter in thermal communication with the light source; wherein the thermal transporter comprises a plurality of graphite sheets structured to transfer heat generated by the light source away from the light source.

Abstract: Lamp assembly with thermal transporter. The present disclosure includes disclosure of a lamp assembly, comprising a housing; a cover attached to the housing defining a volume; a light source disposed within the volume; and a thermal transporter in thermal communication with the light source; wherein the thermal transporter comprises a plurality of graphite sheets structured to transfer heat generated by the light source away from the light source.

Abstract: The present application discloses various embodiments of a heat sink for semiconductor devices and methods for using and constructing the same. According to at least one aspect of the present disclosure, a heat sink for cooling a semiconductor device includes a base plate including a first side and a second side; a leg extending from the second side of the base plate, the leg including a distal end opposite the base plate and opposing walls extending between the base plate and the distal end; a leg plate disposed adjacent the distal end of the leg; a plurality of fins disposed between the distal end of the leg and the leg plate; and a plurality of micro-channels defined by the distal end of the leg, the plurality of fins, and the leg plate.

Abstract: Lamp assembly with thermal transporter. The present disclosure includes disclosure of a lamp assembly, comprising a housing; a cover attached to the housing defining a volume; a light source disposed within the volume; and a thermal transporter in thermal communication with the light source; wherein the thermal transporter comprises a plurality of graphite sheets structured to transfer heat generated by the light source away from the light source.

Abstract: The present application discloses various embodiments of a heat sink for semiconductor devices and methods for using and constructing the same. According to at least one aspect of the present disclosure, a heat sink for cooling a semiconductor device includes a base plate including a first side and a second side; a leg extending from the second side of the base plate, the leg including a distal end opposite the base plate and opposing walls extending between the base plate and the distal end; a leg plate disposed adjacent the distal end of the leg; a plurality of fins disposed between the distal end of the leg and the leg plate; and a plurality of micro-channels defined by the distal end of the leg, the plurality of fins, and the leg plate.