Patents by Inventor Muhannad S. Badir

Muhannad S. Badir has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compliant wafer-level packaging devices and methods of fabrication
    Publication number: 20020127768
    Abstract: Devices and method of fabrication thereof are disclosed. A representative device includes one or more lead packages. The lead packages include a substrate including a plurality of die pads, an overcoat polymer layer, a plurality of sacrificial polymer layers disposed between the substrate and the overcoat polymer layer, and a plurality of leads. Each lead is disposed upon the overcoat polymer layer having a first portion disposed upon a die pad. The sacrificial polymer layer can be removed to form one or more air-gaps.
    Type: Application
    Filed: November 19, 2001
    Publication date: September 12, 2002
    Inventors: Muhannad S. Badir, Hollie Reed, Paul Kohl, Chirag S. Patel, Kevin P. Martin, James Meindl