Patents by Inventor Mukai FUMIHIRO

Mukai FUMIHIRO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally conductive resin molded article
    Patent number: 10457845
    Abstract: A thermally conductive resin molded article having a resin and a thermally conductive filler is provided. The thermally conductive filler is oriented substantially in the thickness direction of the thermally conductive resin molded article. The volumetric filling factor of the thermally conductive filler in the thermally conductive resin molded article is 20-80% by volume. Weld lines in the resin are formed substantially in the thickness direction of the thermally conductive resin molded article. An oil component is included in the thermally conductive resin molded article.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: October 29, 2019
    Assignee: Bando Chemical Industries, Ltd.
    Inventors: Hiroki Naito, Masaya Miyake, Mukai Fumihiro
  • THERMALLY CONDUCTIVE RESIN MOLDED ARTICLE
    Publication number: 20170253783
    Abstract: A thermally conductive resin molded article having a resin and a thermally conductive filler is provided. The thermally conductive filler is oriented substantially in the thickness direction of the thermally conductive resin molded article. The volumetric filling factor of the thermally conductive filler in the thermally conductive resin molded article is 20-80% by volume. Weld lines in the resin are formed substantially in the thickness direction of the thermally conductive resin molded article. An oil component is included in the thermally conductive resin molded article.
    Type: Application
    Filed: August 21, 2015
    Publication date: September 7, 2017
    Inventors: Hiroki NAITO, Masaya MIYAKE, Mukai FUMIHIRO