Abstract: The present disclosure describes systems and methods directed to a user equipment (UE) selecting a network connection. The described systems and methods include the UE receiving a wireless network suggestion requesting connection of the UE to a wireless local area network (WLAN), the wireless network suggestion received from a network-suggesting entity. The UE reviews at least one of connection performance data relating to one or more previous network connections with the WLAN and/or suggestor performance data relating to one or more previous wireless network suggestions received from the network-suggesting entity. The UE then determines, based on the review, whether the connection performance data and/or the suggestor performance data satisfies a criterion. Upon determining that a criterion is satisfied, the UE establishes a wireless connection with the WLAN.

Abstract: The present invention concerns a process for the preparation of a porous carbon structure comprising the steps: a) providing a template comprising voids, b) filling of at least part of the voids with a precursor for the formation of the porous carbon structure, c) carbonizing the precursor for the formation of the porous carbon structure and d) removing at least part of the template. In preferred embodiments the precursor for the formation of the porous carbon structure is a formaldehyde-phenol resin, especially a cross-linked resorcinol-formaldehyde resin. The template further preferably comprises a block copolymer and an amphiphilic molecule, wherein the block copolymer comprises polymeric units of at least one lipophilic monomer and polymeric units of at least one hydrophilic monomer. Further preferred is a process wherein the template comprises a bimodal mixture of particles of silicon dioxide.

Abstract: The disclosure concerns healable polycarbonate resins comprising at least about 5 mol % of disulfide units, articles comprising the healable polycarbonate resin, and methods of activating the healable polycarbonate resin by exposing the healable polycarbonate resin to heat or radiation.

Abstract: A curable epoxy composition, comprising: 100 parts by weight of an epoxy resin composition comprising one or more epoxy resins, each independently having an epoxy equivalent weight of at least 2; 30 to 200 parts by weight of an aromatic dianhydride curing agent of formula (1) wherein T is —O—, —S—, —C(O)—, —SO2—, —SO—, —CyH2y— wherein y is an integer from 1 to 5 or a halogenated derivative thereof, or —O—Z—O— wherein Z is an aromatic C6-24 monocyclic or polycyclic moiety optionally substituted with 1 to 6 C1-8 alkyl groups, 1 to 8 halogen atoms, or a combination comprising at least one of the foregoing, wherein the composition does not contain a catalyst.

Abstract: A thermoplastic composition comprising a copolycarbonate comprising bisphenol A carbonate units and second carbonate units of formula (1a) wherein R is a C1-25 hydrocarbyl; each occurrence of R2 and R3 is independently a halogen or a C1-25 hydrocarbyl; p is 0 to 4; and each q is independently 0 to 3; and optionally a bisphenol A homopolycarbonate.

Abstract: A thermoset epoxy composition, comprising the cured product of a thermosetting epoxy composition comprising: 100 parts by weight of an epoxy resin composition comprising one or more epoxy resins, each independently having an epoxy equivalent weight of at least 2; 30-200 parts by weight of an aromatic dianhydride curing agent of the formula wherein T is as provided herein; and 0.1-5 parts by weight of a heterocyclic accelerator, based on the total parts by weight of the epoxy resin composition and the aromatic dianhydride curing agent, wherein the heterocyclic accelerator comprises a substituted or unsubstituted C3-6 heterocycle comprising 1-4 ring heteroatoms, wherein each heteroatom is independently the same or different, and is nitrogen, oxygen, phosphorus, silicon, or sulfur, wherein the aromatic dianhydride curing agent is soluble in the epoxy resin composition, and the curable epoxy composition does not contain a monoanhydride.

Abstract: A curable epoxy composition includes an epoxy resin composition; a hardener composition comprising an aromatic dianhydride curing agent of the formula wherein T is —O—, —S—, —SO2—, —SO—, —CyH2y— wherein y is an integer from 1 to 5 or a halogenated derivative thereof, or —O—Z—O— wherein Z is an aromatic C6-24 monocyclic or polycyclic moiety optionally substituted with 1 to 6 C1-8 alkyl groups, 1 to 8 halogen atoms, or a combination thereof, and the aromatic dianhydride has a melting point of 220° C. or less; and at least one additional anhydride curing agent different from the aromatic dianhydride curing agent; and 0.1 to 5 wt % of a heterocyclic accelerator, wherein the heterocyclic accelerator comprises a substituted or unsubstituted C3-6 heterocycle comprising 1 to 4 ring heteroatoms, wherein each heteroatom is nitrogen, oxygen, phosphorus, silicon, or sulfur.

Abstract: A curable epoxy composition comprises 100 parts by weight of an epoxy resin composition comprising one or more epoxy resins, each independently having an epoxy equivalent weight of at least 2; 30 to 200 parts by weight of an aromatic dianhydride curing agent of the formula wherein T and y are as provided herein; and 0.1 to 5 parts by weight of a heterocyclic accelerator, based on the total parts by weight of the epoxy resin composition and the aromatic dianhydride curing agent, wherein the heterocyclic accelerator comprises a substituted or unsubstituted C3-6 heterocycle comprising 1 to 4 ring heteroatoms, wherein each heteroatom is independently the same or different, and is nitrogen, oxygen, phosphorus, silicon, or sulfur, wherein the composition does not contain a monoanhydride curing agent.

Abstract: The disclosure concerns healable polycarbonate resins comprising at least about 5 mol % of disulfide units, articles comprising the healable polycarbonate resin, and methods of activating the healable polycarbonate resin by exposing the healable polycarbonate resin to heat or radiation.

Abstract: Embodiments described include systems, apparatuses, and methods using sectored dynamic random access memory (DRAM) cache. An exemplary apparatus may include at least one hardware processor core and a sectored dynamic random access (DRAM) cache coupled to the at least one hardware processor core.

Abstract: The present invention concerns a process for the preparation of a porous carbon structure comprising the steps: a) providing a template comprising voids, b) filling of at least part of the voids with a precursor for the formation of the porous carbon structure, c) carbonizing the precursor for the formation of the porous carbon structure and d) removing at least part of the template. In preferred embodiments the precursor for the formation of the porous carbon structure is a formaldehyde-phenol resin, especially a cross-linked resorcinol-formaldehyde resin. The template further preferably comprises a block copolymer and an amphiphilic molecule, wherein the block copolymer comprises polymeric units of at least one lipophilic monomer and polymeric units of at least one hydrophilic monomer. Further preferred is a process wherein the template comprises a bimodal mixture of particles of silicon dioxide.

Abstract: Embodiments described include systems, apparatuses, and methods using sectored dynamic random access memory (DRAM) cache. An exemplary apparatus may include at least one hardware processor core and a sectored dynamic random access (DRAM) cache coupled to the at least one hardware processor core.