Abstract: A configurable die including a logic element configured to communicate a control and address (CA) signal and a data (DQ) signal, and a first generic physical interface (PHY) and a second generic PHY in communication with the logic element, wherein each of the first generic PHY and the second generic PHY is configurable as a CA PHY and as a DQ PHY, and wherein the logic element is configurable to communicate the CA signal and the DQ signal to different ones of the first and second generic PHYs.

Abstract: The inventive method comprises chemically-mechanically polishing a substrate comprising at least one layer of silicon carbide with a polishing composition comprising a liquid carrier, an abrasive, and an oxidizing agent.

Abstract: A method and system is provided for improved polishing or planarizing of aluminum oxide and/or aluminum oxynitride substrates. Specifically, the composition comprises an abrasive, a liquid carrier, and a phosphorus-type mono-acid. Preferably, the phosphorus-type mono-acid is phosphoric acid, phosphonoacetic acid, phosphorous acid, methyl phosphonic acid, or mixtures thereof. The control of the pH of the composition further improves polishing rates.

Abstract: The inventive method comprises chemically-mechanically polishing a substrate comprising at least one layer of silicon carbide with a polishing composition comprising a liquid carrier, an abrasive, and an oxidizing agent.

Abstract: The inventive method comprises chemically-mechanically polishing a substrate comprising at least one layer of silicon carbide with a polishing composition comprising a liquid carrier, an abrasive, and an oxidizing agent.

Abstract: An improved composition and method for polishing a sapphire surface is disclosed. The method comprises abrading a sapphire surface, such as a C-plane or R-plane surface of a sapphire wafer, with a polishing slurry comprising an abrasive amount of an inorganic abrasive material such as colloidal silica suspended in an aqueous medium having a salt compound dissolved therein. The aqueous medium has a basic pH and includes the salt compound in an amount sufficient to enhance the sapphire removal rate relative to the rate achievable under the same polishing conditions using a the same inorganic abrasive in the absence of the salt compound.

Abstract: A sensing apparatus for detecting a processing endpoint of a multi-layer semiconductor wafer includes a light source to emit light against a surface of the semiconductor wafer, a color sensor to sense a reflection color from the surface of the semiconductor wafer in response to the incident light and to generate a sensor signal, and a decision circuit coupled to the color sensor and configured to decide whether the wafer processing endpoint has been reached based at least in part on the sensor signal. In another embodiment, a sensing apparatus is coupled to a movable structure to position the sensing apparatus to sense the surface of the semiconductor wafer.

Abstract: An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.

Abstract: An apparatus for polishing a workpiece includes a workpiece holder configured to hold the workpiece, a polishing member configured to be positioned adjacent to a face of the workpiece in order to polish the workpiece face with a front side of the polishing member, and a platen having a plurality of pressure zones configured to selectively apply pressure to the polishing member thereby causing the polishing member to contact the workpiece face with selective pressure. In another embodiment, the apparatus includes a pressure controller coupled to the platen and configured to selectively adjust the pressure zones.

Abstract: A sensing apparatus for detecting a processing endpoint of a multi-layer semiconductor wafer includes a light source to emit light against a surface of the semiconductor wafer, a color sensor to sense a reflection color from the surface of the semiconductor wafer in response to the incident light and to generate a sensor signal, and a decision circuit coupled to the color sensor and configured to decide whether the wafer processing endpoint has been reached based at least in part on the sensor signal. In another embodiment, a sensing apparatus is coupled to a movable structure to position the sensing apparatus to sense the surface of the semiconductor wafer.

Abstract: A method for removing conductive metals on a semiconductor chip while leaving a foundation on which the conductive metal is in contact with substantially intact. The foundation includes a dielectric layer and a connecting stud. The dielectric layer is formed from a material which has a relatively high reactivity to an attack by a base, but has a relatively low reactivity to an attack by acid. A first planarization process is applied to the semiconductor chip, the first planarization process attacks the conductive metal at a high rate and is discontinued prior to when the connecting stud via is exposed to direct effects of the first planarization process. A second planarization process is applied to the semiconductor chip. The second planarization process attacks the conductive metal at a relatively high rate, but attacks the connecting stud at a low rate. The second planarization process substantially removes what is left of the conductive metal after the first planarization process.

Abstract: An improved apparatus and process are described in which a direct negative is formed using commercially available multi-stylus recording heads. A negative precursor comprised of a transparent support and an opaque thermoplastic ink layer carried thereon, is brought into contact with an ink receiving medium comprised of a resistive layer and a thin conductive ink receiving layer thereon. Electrical currents are provided by the recording styli of the multi-stylus recording head to the resistive layer to provide sufficient heat to soften regions of the opaque ink brought into contact with the conductive layer, by which regions of said opaque ink are transferred to the ink receiving conductive layer. In this manner, a pattern of opaque ink regions is removed from the surface of said transparent support, whereby a direct negative is formed having light opaque and light transparent regions.

Abstract: An improved thermal transfer resistive ribbon usable in high resolution printing comprising a dual resistive layer formed of a first layer of low resistivity and a second layer of high resistivity, method of production thereof, use thereof and apparatus including the same.

Abstract: An improved apparatus and process are described in which metal images are transferred to a softenable receiving layer using commercially available multi-stylus recording heads. The transfer medium is comprised of a resistive layer and a thin metal layer thereon. Electrical currents are provided by the recording styli of the multi-stylus recording head. Localized electrical currents in the resistive layer provide sufficient heat in the metal layer to soften regions of a metable receiving layer when it is brought into contact with said heated metal layer. Metal imaging for use in printed circuit board manufacture and in formation of printing masters can be transferred by this technique.