Patents by Inventor Mukta Faroog

Mukta Faroog has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module and method for forming the same
    Publication number: 20050110160
    Abstract: Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.
    Type: Application
    Filed: November 25, 2003
    Publication date: May 26, 2005
    Applicant: International Business Machines Corporation
    Inventors: Mukta Faroog, John Knickerbocker, Frank Pompeo, Subhash Shinde