Abstract: A method of storing data on a storage appliance with at least one non-volatile memory. The method comprising associating a first portion of a storage capacity of the at least one non-volatile memory to a first application of a plurality of applications, and associating a second portion of the storage capacity of the at least one non-volatile memory to a second application of the plurality of applications. The method also comprises receiving a request to write data associated with the first application to the at least one non-volatile memory and determining that the first portion does not have capacity to store the write data. Additionally, the method comprises requesting the second application to remove data stored in the second portion, reassociating a portion of the storage capacity of the second portion to the first portion, and storing the write data in the first portion.

Abstract: The disclosed technology includes monolithic framework for an end effector of a medical device. The monolithic framework includes cylindrical stock. The cylindrical stock includes a crown and multiple spines. The crown extends along a longitudinal axis, defines a crown lumen, and defines a plurality of crown recesses that, in use, connect to an annulus. The plurality of spines also extend along the longitudinal axis and bow outwardly relative to the longitudinal axis. Each spine extends from the crown to a spine terminal end and, in use, connects to a connecting hub.

Abstract: The disclosed technology includes a connecting hub used with an end effector of a medical probe. The connecting hub is generally cylindrical in form and defines a hub lumen extending along a longitudinal axis between its terminal ends. Recesses are disposed about an outer circumferential surface of the cylindrical body and extend parallel to the longitudinal axis. Each recess is open along the longitudinal axis at or proximal the first terminal end and mates with a proximal end or a distal end of a spine of the end effector.

Abstract: The disclosed technology includes irrigation manifold that routes irrigation fluid to an end effector for a medical device. The irrigation manifold includes a housing and a diverter that extend along a longitudinal axis and respectively connect with irrigation tubes. The end effector includes jackets that each define an irrigation conduit connecting with the irrigation manifold to allow an even distribution of irrigation fluid flow through the jackets.

Abstract: A method of storing data on a storage appliance with at least one non-volatile memory. The method comprising associating a first portion of a storage capacity of the at least one non-volatile memory to a first application of a plurality of applications, and associating a second portion of the storage capacity of the at least one non-volatile memory to a second application of the plurality of applications. The method also comprises receiving a request to write data associated with the first application to the at least one non-volatile memory and determining that the first portion does not have capacity to store the write data. Additionally, the method comprises requesting the second application to remove data stored in the second portion, reassociating a portion of the storage capacity of the second portion to the first portion, and storing the write data in the first portion.

Abstract: A memory controller may include a dynamic arbitration scheme to dynamically vary arbitration factors of two or more traffic classes based on dynamic latency tolerance, requested and available bandwidths on an interconnect from source agents to memory controllers, and other dynamic and static factors.

Abstract: A memory controller may include a dynamic arbitration scheme to dynamically vary arbitration factors of two or more traffic classes based on dynamic latency tolerance, requested and available bandwidths on an interconnect from source agents to memory controllers, and other dynamic and static factors.

Abstract: A method of storing data on a storage appliance with at least one non-volatile memory. The method comprising associating a first portion of a storage capacity of the at least one non-volatile memory to a first application of a plurality of applications, and associating a second portion of the storage capacity of the at least one non-volatile memory to a second application of the plurality of applications. The method also comprises receiving a request to write data associated with the first application to the at least one non-volatile memory and determining that the first portion does not have capacity to store the write data. Additionally, the method comprises requesting the second application to remove data stored in the second portion, reassociating a portion of the storage capacity of the second portion to the first portion, and storing the write data in the first portion.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an interposer having an interposer first side and an interposer second side opposing the interposer first side; mounting an integrated circuit to the interposer first side, the integrated circuit having a non-active side and an active side with the non-active side facing the interposer; connecting first interconnects between the active side and the interposer first side, the first interconnects having a first density on the interposer first side; mounting the interposer over a package carrier with the interposer first side facing the package carrier; connecting second interconnects between the package carrier and the interposer second side, the second interconnects having a second density on the interposer second side, the second density that is approximately the same as the first density; and forming an encapsulation over the package carrier covering the interposer and the second interconnects.

Abstract: A method of manufacture of an integrated circuit system includes: providing a substrate having a transistor and a metallization layer; forming a metal pad in direct contact with the metallization layer of the substrate; forming a passivation layer in direct contact with the metal pad and covering the substrate; forming a routing trace above the passivation layer in direct contact with the metal pad, and the routing trace is substantially larger than the metal pad, and the routing trace is not electrically insulated by a subsequent layer; and forming a bump connected to the metal pad with the routing trace.

Abstract: A method of implementing a discrete component in an integrated circuit package is described. The method includes steps of coupling the discrete component to a surface of a substrate of the integrated circuit package, coupling an integrated circuit die to the surface of the substrate, applying a first epoxy material, and applying a second epoxy material to the discrete component, where the first epoxy material is different from the second epoxy material.

Abstract: A method of implementing a capacitor in an integrated circuit package is disclosed. The method comprises coupling the capacitor to a first surface of a substrate of the integrated circuit package; positioning an integrated circuit die over the capacitor, wherein the integrated circuit die has a first plurality of solder bumps and a second plurality of solder bumps separated by a region having no solder bumps; coupling the integrated circuit die to the first surface of the substrate over the capacitor, wherein the region having no solder bumps is positioned over the capacitor; and encapsulating the integrated circuit die and the capacitor.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing an interposer having an interposer first side and an interposer second side opposing the interposer first side; mounting an integrated circuit to the interposer first side, the integrated circuit having a non-active side and an active side with the non-active side facing the interposer; connecting first interconnects between the active side and the interposer first side, the first interconnects having a first density on the interposer first side; mounting the interposer over a package carrier with the interposer first side facing the package carrier; connecting second interconnects between the package carrier and the interposer second side, the second interconnects having a second density on the interposer second side, the second density that is approximately the same as the first density; and forming an encapsulation over the package carrier covering the interposer and the second interconnects.

Abstract: A method of manufacture of an integrated circuit system includes: providing a substrate having a transistor and a metallization layer; forming a metal pad in direct contact with the metallization layer of the substrate; forming a passivation layer in direct contact with the metal pad and covering the substrate; forming a routing trace above the passivation layer in direct contact with the metal pad, and the routing trace is substantially larger than the metal pad, and the routing trace is not electrically insulated by a subsequent layer; and forming a bump connected to the metal pad with the routing trace.

Abstract: An integrated circuit package has a substrate; a discrete capacitor coupled to a first surface of the substrate; an integrated circuit die coupled to the first surface of the substrate over the discrete capacitor; and a lid coupled to the substrate, the lid encapsulating the integrated circuit die and the discrete capacitor.

Abstract: A packaged integrated circuit including a package substrate having electrical contacts for receiving an integrated circuit. The integrated circuit is electrically connected to the electrical contacts of the package substrate. A stiffener is mounted to the package substrate, where the stiffener has a non-orthogonal cut out in which the integrated circuit is disposed. The edges of the cut out are disposed at no greater a distance from the corners of the integrated circuit than they are from the sides of the integrated circuit.

Abstract: A user can highlight text and provide accompanying annotations. Highlighted text, accompanying annotations, and time-stamp information are stored in a user profile that is maintained locally with a web browser, at the client side. A retrieved web page is presented to a user with annotations of some form, based upon the user profile. The retrieved web page may typically be annotated through marked or highlighted portions of text, so that the user can readily locate this information in the web page, and assess the relevance of the retrieved page.

Abstract: A method of underfilling an integrated circuit that is mounted to a first side of a package substrate having an opposing second side. A void is provided, which extends completely through the package substrate and is disposed under the integrated circuit. The package substrate is disposed with the second side up and the first side and the integrated circuit down. An underfill material is dispensed into the void on the second side of the package substrate. The underfill material thereby flows first through the void and then between the first side of the package substrate and the integrated circuit.

Abstract: A user can highlight text and provide accompanying annotations. Highlighted text, accompanying annotations, and time-stamp information are stored in a user profile that is maintained locally with a web browser, at the client side. A retrieved web page is presented to a user with annotations of some form, based upon the user profile. The retrieved web page may typically be annotated through marked or highlighted portions of text, so that the user can readily locate this information in the web page, and assess the relevance of the retrieved page.

Abstract: Triggers are dynamically created and destroyed on an application database. Rules are represented in active databases as ECA (event-condition-action) items, in which an action formulates a reaction to an event and is executed after the rule is triggered when the condition is evaluated to true. The event is defined as an instantaneous and atomic (that is, the event either happens completely, or not at all) point of occurrence within an application. Events can be classified as either database, temporal, or user-defined events, and their type can be either primitive or composite.