Patents by Inventor Mumtaz Bora

Mumtaz Bora has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RELIABLE PRINTED WIRING BOARD ASSEMBLY EMPLOYING PACKAGES WITH SOLDER JOINTS AND RELATED ASSEMBLY TECHNIQUE
    Publication number: 20080064139
    Abstract: An exemplary assembly comprises a printed wiring board having a first surface, and a package including a plurality of solder joints, such as solder balls, on one surface of the package. An anchor via is defined through the first surface of the printed wiring board, and conductive material situated in the anchor via is connected to or integral with a respective solder joint of the package.
    Type: Application
    Filed: November 12, 2007
    Publication date: March 13, 2008
    Inventors: Mumtaz BORA, Charles Girardot
  • Reliable printed wiring board assembly employing packages with solder joints and related assembly technique
    Publication number: 20060065977
    Abstract: An exemplary assembly comprises a printed wiring board having a first surface, and a package including a plurality of solder joints, such as solder balls, on one surface of the package. An anchor via is defined through the first surface of the printed wiring board, and conductive material situated in the anchor via is connected to or integral with a respective solder joint of the package.
    Type: Application
    Filed: September 30, 2004
    Publication date: March 30, 2006
    Inventors: Mumtaz Bora, Charles Girardot