Patents by Inventor Mun Fai Low

Mun Fai Low has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Capillary underfill and mold encapsulation method and apparatus
    Patent number: 7262077
    Abstract: A method of packaging a die includes attaching the die to a substrate; underfilling the space between the die and the substrate with a first material, and placing a second material in contact with at least a portion of the die and the substrate after underfilling the space between the die and substrate with the first material. A system includes a semiconductor package having a substrate, a die attached to the substrate, an underfill material positioned between the die and the substrate, and a molding material in contact with at least a portion of the substrate and the die. A heat sink is also in thermal contact with the semiconductor package.
    Type: Grant
    Filed: September 30, 2003
    Date of Patent: August 28, 2007
    Assignee: Intel Corporation
    Inventors: Yin Men Lai, Choong Kooi Chee, Edward Then, Cheong Huat Ng, Mun Fai Low