Abstract: Examples discussed herein relate to managing power allocation for devices, such as network devices, with processing chip. In some examples, based on determining that a first temperature measurement of the processing chip does not satisfy an operating temperature threshold, the network device allocates power from a power source to a first heating element of the network device to heat the processing chip & allocates power from the power source to a second heating element of the network device to heat the processing chip. Based on determining that a second temperature measurement satisfies the operating temperature threshold, the network device allocates power from the power source to a set of power over ethernet ports of the network device & the first amount of power from the power source selectively to the first heating element to heat the processing chip.

Abstract: Example implementations relate to an insertion key assembly for a pluggable module. The insertion key assembly includes a stopper element having a stopping tab, a biasing element, and a driver element having a driving tab. The biasing element is connected to the stopper element and the driver element. In a relaxed state of the biasing element: i) the stopper element is pushed outwards by the biasing element to protrude the stopping tab into a passageway defined by a plurality of walls of a chassis, to block insertion of the pluggable module inside the passageway, and ii) the driver element is pushed outwards by the biasing element to protrude the driving tab into adjacent passageway. In a biased state of the biasing element, the stopper element is pulled inwards by the biasing element to retract the stopping tab from the passageway to allow insertion of the pluggable module inside the passageway.

Abstract: Example implementations relate to an insertion key assembly for a pluggable module. The insertion key assembly includes a stopper element having a stopping tab, a biasing element, and a driver element having a driving tab. The biasing element is connected to the stopper element and the driver element. In a relaxed state of the biasing element: i) the stopper element is pushed outwards by the biasing element to protrude the stopping tab into a passageway defined by a plurality of walls of a chassis, to block insertion of the pluggable module inside the passageway, and ii) the driver element is pushed outwards by the biasing element to protrude the driving tab into adjacent passageway. In a biased state of the biasing element, the stopper element is pulled inwards by the biasing element to retract the stopping tab from the passageway to allow insertion of the pluggable module inside the passageway.

Abstract: A technique and corresponding device to provide for a floating heat sink is disclosed. The technique includes a method that allows for insertion of an electronic component (e.g., an optical transceiver) into a cage that has a pre-installed heatsink. At the beginning phases of insertion, no friction is present between the electronic component and the heatsink. At or very near an insertion end phase (the electronic component is almost fully inserted), an actuator (e.g., roller or button) is impacted to impart a pivot motion via a lever arm to cause lowering of the heatsink toward the electronic component. A thermal interface material (TIM) may therefore be present to establish a thermal coupling between the heatsink and the electronic component. The TIM and heatsink contact the electronic component via a downward motion (caused by the pivot) to provide a nearly frictionless sliding impact to the TIM.

Abstract: A technique and corresponding device to provide for a floating heat sink is disclosed. The technique includes a method that allows for insertion of an electronic component (e.g., an optical transceiver) into a cage that has a pre-installed heatsink. At the beginning phases of insertion, no friction is present between the electronic component and the heatsink. At or very near an insertion end phase (the electronic component is almost fully inserted), an actuator (e.g., roller or button) is impacted to impart a pivot motion via a lever arm to cause lowering of the heatsink toward the electronic component. A thermal interface material (TIM) may therefore be present to establish a thermal coupling between the heatsink and the electronic component. The TIM and heatsink contact the electronic component via a downward motion (caused by the pivot) to provide a nearly frictionless sliding impact to the TIM.

Abstract: Examples discussed herein relate to managing power allocation for devices, such as network devices, with processing chip. In some examples, based on determining that a first temperature measurement of the processing chip does not satisfy an operating temperature threshold, the network device allocates power from a power source to a first heating element of the network device to heat the processing chip & allocates power from the power source to a second heating element of the network device to heat the processing chip. Based on determining that a second temperature measurement satisfies the operating temperature threshold, the network device allocates power from the power source to a set of power over ethernet ports of the network device & the first amount of power from the power source selectively to the first heating element to heat the processing chip.

Abstract: A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.

Abstract: A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.

Abstract: A computer system detects that it is coupled to a pedestal having a cooling fan. The computer system signals the cooling fan of the pedestal to operate, and signals cooling fans within the computer system to operate at lower rotational speeds having lower acoustic levels.

Abstract: A baffle is provided proximate an array of fans used to cool electronic components. The baffle may assume different orientations with respect to the array of fans.

Abstract: A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.

Abstract: A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.

Abstract: A baffle is provided proximate an array of fans used to cool electronic components. The baffle may assume different orientations with respect to the array of fans.

Abstract: A computer system detects that it is coupled to a pedestal having a cooling fan. The computer system signals the cooling fan of the pedestal to operate, and signals cooling fans within the computer system to operate at lower rotational speeds having lower acoustic levels.

Abstract: A first riser card of an apparatus in an example substantially axially connects with a first serial connection external interface of a printed circuit board (PCB) and at least in part laterally connects with a parallel connection external interface of a first memory module. The first riser card supports the first memory module with avoidance of abutment of the first memory module with a second memory module supported by a second riser card that is adjacent to the first riser card.