Abstract: A lead frame having a die support area for supporting a semiconductor die, a plurality of leads surrounding the die support area, and a dam bar connecting adjacent leads. The dam bar has a dummy tab between adjacent ones of the leads that transversely extends towards the die support area. The presence of the dummy tab reduces the volume of mold compound between the lead frame leads and thus, when the lead frame is cut via punching, only the lead frame is cut and not the molding material. This reduces mechanical stress during singulation significantly and as a result, the occurrence of package cracking is reduced. In addition, less mold compound at the dam bar inter-lead reduces debris during cutting, which in turn reduces debris from contaminating the package.