Patents by Inventor Munawar Kermalli
Munawar Kermalli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11909424Abstract: In certain embodiments, an apparatus includes a switch matrix and frequency band isolation circuitry. The switch matrix is configured to receive, at an input port, an electrical signal, which corresponds to a transmission signal received at antennas of an antenna array. The transmission signal corresponds to a transmission spatial sector of the array. The electrical signal includes first and second signal portions in first and second frequency bands, respectively, the electrical signal having been generated from an optical signal that corresponds to the transmission signal. The switch matrix is configured to direct, via an output port and in accordance with a control signal, the electrical signal to a first of multiple signal conversion paths.Type: GrantFiled: December 3, 2021Date of Patent: February 20, 2024Assignees: Futurewei Technologies, Inc., Phase Sensitive Innovations, Inc.Inventors: Stefano Galli, Munawar Kermalli, Xiao-Feng Qi, Shouyuan Shi, Dennis Prather, Janusz Murakowski, Garrett Schneider
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Patent number: 11757204Abstract: A modular wideband antenna includes a ground plane, first and second antenna elements disposed on a first surface of a substrate, a first portion of a two-layer feed balun disposed on the first surface of the substrate, and electrically coupled to the first and second antenna elements, and to the ground plane, a second portion of the two-layer feed balun disposed on a second surface of the substrate, the second portion of the two-layer feed balun being electrically coupled to a signal feed, and being capacitively coupled to the first portion of the two-layer feed balun, first and second coupling capacitances disposed on the second surface of the substrate, the first coupling capacitance being capacitively coupled to the first antenna element, and the second coupling capacitance being capacitively coupled to the second antenna element, and first and second grounding posts being electrically coupled to the first and second coupling capacitances.Type: GrantFiled: February 22, 2022Date of Patent: September 12, 2023Assignees: Futurewei Technologies, Inc., Novaa Ltd.Inventors: Markus Novak, Ahmed Hassan Abdelaziz Abdelrahman, Zhengxiang Ma, Munawar Kermalli, Leonard Piazzi
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Publication number: 20220337275Abstract: An antenna of a communication device includes a first antenna element operatively coupled to a transmitter of the communication device, the first antenna element configured to radiate a first signal generated by the transmitter; a second antenna element operatively coupled to a receiver of the communication device, the second antenna element configured to receive signals; and at least one third antenna element operatively coupled to at least one first reactive load, the at least one third antenna element configured to radiate a second signal modified in accordance with the at least one first reactive load, the second signal being induced at the at least one third antenna element by the first signal, and the at least one first reactive load being configured to modify the second signal to destructively cancel with a third signal induced at the second antenna element by the first signal.Type: ApplicationFiled: July 1, 2022Publication date: October 20, 2022Inventors: Munawar Kermalli, Ahmed Hassan Abdelaziz Abdelrahman, Zhengxiang Ma
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Publication number: 20220181790Abstract: A modular wideband antenna includes a ground plane, first and second antenna elements disposed on a first surface of a substrate, a first portion of a two-layer feed balun disposed on the first surface of the substrate, and electrically coupled to the first and second antenna elements, and to the ground plane, a second portion of the two-layer feed balun disposed on a second surface of the substrate, the second portion of the two-layer feed balun being electrically coupled to a signal feed, and being capacitively coupled to the first portion of the two-layer feed balun, first and second coupling capacitances disposed on the second surface of the substrate, the first coupling capacitance being capacitively coupled to the first antenna element, and the second coupling capacitance being capacitively coupled to the second antenna element, and first and second grounding posts being electrically coupled to the first and second coupling capacitances.Type: ApplicationFiled: February 22, 2022Publication date: June 9, 2022Inventors: Markus Novak, Ahmed Hassan Abdelaziz Abdelrahman, Zhengxiang Ma, Munawar Kermalli, Leonard Piazzi
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Publication number: 20220166137Abstract: In certain embodiments, a system includes an optical switch matrix, an optical lens coupled to the switch matrix, and a wireless transmitter coupled to the lens. The switch matrix is configured to switch first optical signals from input ports to output ports of the switch matrix, and output second optical signals that are based at least partially on the first optical signals. The lens is configured to transform wave formats of the second optical signals based on the output ports over which the second optical signals are received. The transmitter includes an antenna array and circuitry coupled to the array. The circuitry is configured to receive the second optical signals from the lens, convert the second optical signals into beamformed wireless signals in accordance with the transformed formats, and transmit the beamformed wireless signals, which signals have spatial characteristics in accordance with the transformed formats, over the array.Type: ApplicationFiled: December 3, 2021Publication date: May 26, 2022Inventors: Stefano Galli, Munawar Kermalli, Xiao-Feng Qi, Shouyuan Shi, Dennis Prather, Janusz Murakowski, Garrett Schneider
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Publication number: 20220094374Abstract: In certain embodiments, an apparatus includes a switch matrix and frequency band isolation circuitry. The switch matrix is configured to receive, at an input port, an electrical signal, which corresponds to a transmission signal received at antennas of an antenna array. The transmission signal corresponds to a transmission spatial sector of the array. The electrical signal includes first and second signal portions in first and second frequency bands, respectively, the electrical signal having been generated from an optical signal that corresponds to the transmission signal. The switch matrix is configured to direct, via an output port and in accordance with a control signal, the electrical signal to a first of multiple signal conversion paths.Type: ApplicationFiled: December 3, 2021Publication date: March 24, 2022Inventors: Stefano Galli, Munawar Kermalli, Xiao-Feng Qi, Shouyuan Shi, Dennis Prather, Janusz Murakowski, Garrett Schneider
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Patent number: 10622736Abstract: A radio frequency (RF) device includes a first and second substrate, a first and second circuit, and an interconnect circuit. Each substrate having a first surface and an opposing second surface, a thickness of the second substrate being greater than a thickness of the first substrate, the second substrate having an overhang portion extending over the first surface of the first substrate. The first circuit disposed on the first substrate having a first contact terminal on the first surface of the first substrate. The second circuit disposed on the second substrate, the second circuit having a second contact terminal on the first surface of the second substrate. The interconnect circuit disposed on the overhang portion of the second substrate. The interconnect circuit including a vertical metal structure electrically connecting the first contact terminal to the second contact terminal.Type: GrantFiled: July 10, 2018Date of Patent: April 14, 2020Assignee: Futurewei Technologies, Inc.Inventors: Munawar Kermalli, Michael Russo
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Publication number: 20200021046Abstract: A radio frequency (RF) device includes a first and second substrate, a first and second circuit, and an interconnect circuit. Each substrate having a first surface and an opposing second surface, a thickness of the second substrate being greater than a thickness of the first substrate, the second substrate having an overhang portion extending over the first surface of the first substrate. The first circuit disposed on the first substrate having a first contact terminal on the first surface of the first substrate. The second circuit disposed on the second substrate, the second circuit having a second contact terminal on the first surface of the second substrate. The interconnect circuit disposed on the overhang portion of the second substrate. The interconnect circuit including a vertical metal structure electrically connecting the first contact terminal to the second contact terminal.Type: ApplicationFiled: July 10, 2018Publication date: January 16, 2020Inventors: Munawar Kermalli, Michael Russo
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Patent number: 9543911Abstract: Methods and apparatus are provided to improve the efficiency of an outphasing amplifier through modulating the phase angle of a reflected signal in the outphasing amplifier. An outphasing amplifier includes a first amplifier and a second amplifier. A circulator is provided having a first port coupled to an output of the outphasing amplifier, a second port coupled to a load and a third port coupled to a phase shifter. The phase shifter is configured to provide a different phase angle of a reflected signal from the phase shifter to the outphasing amplifier through the circulator.Type: GrantFiled: May 19, 2014Date of Patent: January 10, 2017Assignee: FUTUREWEI TECHNOLOGIES, INC.Inventors: Munawar Kermalli, Zhengxiang Ma
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Patent number: 9197465Abstract: System and method embodiments are provided for improving power efficiency in an outphasing amplifier with a non-isolating combiner. Some embodiments include a circuit comprising a signal decomposer configured to receive an input signal, a non-isolating combiner coupled to the signal decomposer and configured to provide an amplified output signal corresponding to the input signal, a first power amplifiers (PA) on a first branch between the signal decomposer and the non-isolating combiner, a second PA on a second branch between the signal decomposer and the non-isolating combiner, and a switch on the second branch between the signal decomposer and the second PA. The switch is configured to disconnect the second PA from the signal decomposer upon determining that the input signal is in a first condition, and further configured to connect the second PA to the signal decomposer upon determining otherwise.Type: GrantFiled: March 5, 2014Date of Patent: November 24, 2015Assignee: FUTUREWEI TECHNOLOGIES, INC.Inventors: Zhengxiang Ma, Munawar Kermalli
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Publication number: 20150333701Abstract: Methods and apparatus are provided to improve the efficiency of an outphasing amplifier through modulating the phase angle of a reflected signal in the outphasing amplifier. An outphasing amplifier includes a first amplifier and a second amplifier. A circulator is provided having a first port coupled to an output of the outphasing amplifier, a second port coupled to a load and a third port coupled to a phase shifter. The phase shifter is configured to provide a different phase angle of a reflected signal from the phase shifter to the outphasing amplifier through the circulator.Type: ApplicationFiled: May 19, 2014Publication date: November 19, 2015Applicant: Futurewei Technologies, Inc.Inventors: Munawar Kermalli, Zhengxiang Ma
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Patent number: 9190967Abstract: Apparatus and method embodiments are provided for improving power efficiency in an outphasing amplifier with a non-isolating combiner. The embodiments include reducing the driving power to two power amplifiers (PAs) of the amplifier circuit in the low input signal power region in an asymmetric manner between the two PAs. An embodiment method includes receiving, at a signal decomposer, an input signal, detecting a power amplitude of the input signal, and determining whether the input signal corresponds to one of a plurality of operation modes according to the detected power amplitude of the input signal and a plurality of power thresholds corresponding to the operation modes. Upon determining that the power amplitude of the input signal corresponds to a first mode from the operation modes, the input signal is decomposed into two component signals including at least one signal that has a reduced and scaled amplitude proportional to the input signal.Type: GrantFiled: March 4, 2014Date of Patent: November 17, 2015Assignee: Futurewei Technologies Inc.Inventors: Zhengxiang Ma, Ruikang Yang, Munawar Kermalli
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Patent number: 9083294Abstract: System and method embodiments are provided for a multilevel outphasing amplifier architecture with a non-isolating or lossless combiner. The multilevel outphasing amplifier with lossless combiner improves power efficiency in comparison to outphasing amplifiers with lossless combiners. The multilevel outphasing amplifier applies different voltage levels to the power amplifiers (PAs) of the circuit according to the input signal power range. Additionally, tunable reactive compensation is applied to the compensation components (capacitor and inductor) of the lossless combiner as a function of the multilevel voltage setting of the PAs. The efficiency at the back-off region is improved by varying the compensation elements of the lossless combiner along with the drain voltage to the PAs as a function of the input signal power or amplitude.Type: GrantFiled: March 12, 2014Date of Patent: July 14, 2015Assignee: Futurewei Technologies, Inc.Inventor: Munawar Kermalli
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Publication number: 20140269892Abstract: System and method embodiments are provided for improving power efficiency in an outphasing amplifier with a non-isolating combiner. Some embodiments include a circuit comprising a signal decomposer configured to receive an input signal, a non-isolating combiner coupled to the signal decomposer and configured to provide an amplified output signal corresponding to the input signal, a first power amplifiers (PA) on a first branch between the signal decomposer and the non-isolating combiner, a second PA on a second branch between the signal decomposer and the non-isolating combiner, and a switch on the second branch between the signal decomposer and the second PA. The switch is configured to disconnect the second PA from the signal decomposer upon determining that the input signal is in a first condition, and further configured to connect the second PA to the signal decomposer upon determining otherwise.Type: ApplicationFiled: March 5, 2014Publication date: September 18, 2014Applicant: FutureWei Technologies, Inc.Inventors: Zhengxiang Ma, Munawar Kermalli
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Publication number: 20140266464Abstract: Apparatus and method embodiments are provided for improving power efficiency in an outphasing amplifier with a non-isolating combiner. The embodiments include reducing the driving power to two power amplifiers (PAs) of the amplifier circuit in the low input signal power region in an asymmetric manner between the two PAs. An embodiment method includes receiving, at a signal decomposer, an input signal, detecting a power amplitude of the input signal, and determining whether the input signal corresponds to one of a plurality of operation modes according to the detected power amplitude of the input signal and a plurality of power thresholds corresponding to the operation modes. Upon determining that the power amplitude of the input signal corresponds to a first mode from the operation modes, the input signal is decomposed into two component signals including at least one signal that has a reduced and scaled amplitude proportional to the input signal.Type: ApplicationFiled: March 4, 2014Publication date: September 18, 2014Applicant: FutureWei Technologies, Inc.Inventors: Zhengxiang Ma, Ruikang Yang, Munawar Kermalli
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Publication number: 20140266465Abstract: System and method embodiments are provided for a multilevel outphasing amplifier architecture with a non-isolating or lossless combiner. The multilevel outphasing amplifier with lossless combiner improves power efficiency in comparison to outphasing amplifiers with lossless combiners. The multilevel outphasing amplifier applies different voltage levels to the power amplifiers (PAs) of the circuit according to the input signal power range. Additionally, tunable reactive compensation is applied to the compensation components (capacitor and inductor) of the lossless combiner as a function of the multilevel voltage setting of the PAs. The efficiency at the back-off region is improved by varying the compensation elements of the lossless combiner along with the drain voltage to the PAs as a function of the input signal power or amplitude.Type: ApplicationFiled: March 12, 2014Publication date: September 18, 2014Applicant: FutureWei Technologies, Inc.Inventor: Munawar Kermalli
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Publication number: 20050100107Abstract: A method for reducing the PAR of a composite carrier includes obtaining the in-phase and quadrature components for each of the carriers in the composite carrier, computing vector magnitudes corresponding to each carrier, then adding the vector magnitudes and comparing the resulting sum to a threshold. If the sum exceeds the threshold, at least of the one of the carriers are attenuated, thereby reducing the PAR of the composite carrier. In one embodiment, only the carrier or carriers having significantly larger vectors are attenuated. The pre-calculation and the subsequent attenuation process allows the composite carrier PAR to be reduced to avoid peak regrowth when the carriers are ultimately combined and transmitted.Type: ApplicationFiled: November 12, 2003Publication date: May 12, 2005Inventors: Thomas Head, Kaushal Dhar, Munawar Kermalli, Michael Newell
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Publication number: 20050069050Abstract: In a transmitter, an upconverter converts a lower frequency signal to a higher frequency signal. Prior to the upconversion, a compensator compensates for at least gain/phase distortion that will be introduced into the lower frequency signal by at least the upconverter.Type: ApplicationFiled: September 30, 2003Publication date: March 31, 2005Inventors: Lei Ding, Walter Honcharenko, Munawar Kermalli, Zhengxiang Ma, Dennis Morgan