Patents by Inventor Muneaki Asami

Muneaki Asami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7758741
    Abstract: There is here disclosed a nozzle type ELID grinding apparatus comprising a conductive grindstone 12 having a contact surface with a workpiece 1; and an ion supply nozzle 16 that supplies an electrolytic medium 2 containing hydroxyl ions (OH?) onto a surface of the conductive grindstone, the workpiece being ground while the surface of the grindstone is dressed by electrolysis or chemical reaction. Furthermore, the apparatus comprises a grindstone power source 14 for setting the conductive grindstone to be a positive potential (+).
    Type: Grant
    Filed: December 9, 2005
    Date of Patent: July 20, 2010
    Assignees: Riken, The NEXSYS Corporation
    Inventors: Hitoshi Omori, Yoshihiro Uehara, Kazutoshi Katahira, Muneaki Asami, Norihide Mitsuishi, Souichi Ishikawa
  • Publication number: 20060124473
    Abstract: There is here disclosed a nozzle type ELID grinding apparatus comprising a conductive grindstone 12 having a contact surface with a workpiece 1; and an ion supply nozzle 16 that supplies an electrolytic medium 2 containing hydroxyl ions (OH?) onto a surface of the conductive grindstone, the workpiece being ground while the surface of the grindstone is dressed by electrolysis or chemical reaction. Furthermore, the apparatus comprises a grindstone power source 14 for setting the conductive grindstone to be a positive potential (+).
    Type: Application
    Filed: December 9, 2005
    Publication date: June 15, 2006
    Applicants: Riken, The Nexsys Corporation
    Inventors: Hitoshi Omori, Yoshihiro Uehara, Kazutoshi Katahira, Muneaki Asami, Norihide Mitsuishi, Souichi Ishikawa
  • Patent number: 6478661
    Abstract: A voltage is applied between a cylindrical cutting grindstone 2 that rotates about a vertical axis Y and a cylindrical truing grindstone 6 that rotates about a horizontal axis X. The vertical outer surface 2a and the horizontal lower surface 2b of the cutting grindstone are trued by a plasma discharge. Then without applying the voltage, the cutting grindstone 2 is trued mechanically by the truing grindstone 6, and while the outer periphery and lower surface of the cutting grindstone are dressed electrolytically, the outer periphery and lower surface are made to contact a workpiece 1 and process a micro-V groove. This method makes it possible to produce an immersion grating with a high resolution using hard, brittle materials such as germanium, gallium arsenide and lithium niobate.
    Type: Grant
    Filed: February 28, 2001
    Date of Patent: November 12, 2002
    Assignees: Riken, The Nexsys Corporation
    Inventors: Hitoshi Ohmori, Noboru Ebizuka, Yutaka Yamagata, Shinya Morita, Sei Moriyasu, Muneaki Asami
  • Patent number: 6341999
    Abstract: A method for glass substrate chamfering using a metal-bonded outer-surface grindstone 12 for simultaneously processing the end surface and the oblique surfaces of the outer periphery of a doughnut-like glass substrate 1 with a circular hole 1a at the center thereof, and a metal-bonded inner-surface grindstone 14 for simultaneously processing the end surface and the oblique surfaces of the inner periphery are provided; the outer-surface grindstone and the inner-surface grindstone simultaneously grind end surfaces and oblique surfaces of the outer and inner peripheries of the glass substrate, and during grinding, the outer-surface grindstone is sharpened by dressing it electrolytically, and the inner-surface grindstone is sharpened by an electrolytic dressing when not processing as the glass substrate is being replaced.
    Type: Grant
    Filed: September 26, 2000
    Date of Patent: January 29, 2002
    Assignees: Riken, Utksystem Corporation, The Nexsys Corporation
    Inventors: Hitoshi Ohmori, Muneaki Asami, Akihiko Uzawa, Sadamasa Shigitani
  • Publication number: 20010021629
    Abstract: A voltage is applied between a cylindrical cutting grindstone 2 that rotates about a vertical axis Y and a cylindrical truing grindstone 6 that rotates about a horizontal axis X. The vertical outer surface 2a and the horizontal lower surface 2b of the cutting grindstone are trued by a plasma discharge. Then without applying the voltage, the cutting grindstone 2 is trued mechanically by the truing grindstone 6, and while the outer periphery and lower surface of the cutting grindstone are dressed electrolytically, the outer periphery and lower surface are made to contact a workpiece 1 and process a micro-V groove. This method makes it possible to produce an immersion grating with a high resolution using hard, brittle materials such as germanium, gallium arsenide and lithium niobate.
    Type: Application
    Filed: February 28, 2001
    Publication date: September 13, 2001
    Inventors: Hitoshi Ohmori, Noboru Ebizuka, Yutaka Yamagata, Shinya Morita, Sei Moriyasu, Muneaki Asami