Abstract: This invention provides a process for producing an electrolytic copper foil for a printed wiring board by supplying current between a rotary cathode and an electrolytic anode in a copper electrolyte so as to electrodeposit copper on the surface of the rotary cathode, wherein an anode for high electric current is placed opposite to the electrodeposition starting surface of the rotary cathode in such a manner that a part of the anode is projected above a liquid level of the copper electrolyte, and the copper electrolyte existing between the anode for high electric current and the opposed rotary cathode surface is electrolyzed by providing a high electric current with a current density higher than that of the electrolytic anode, and an apparatus for producing an electrolytic copper foil for a printed wiring board having excellent properties.

Abstract: A multilayer printed wiring board wherein circuits are provided respectively on both the faces of a substrate and subsequent circuits are provided in order and via insulating layers respectively on the outsides of the preceding circuits, characterized in that the insulating layers comprise an epoxy resin, polyvinyl acetal resin, melamine or urethane resin and rubber-modified epoxy resin in a specific mixing ratio.

Abstract: This invention provides a process for producing an electrolytic copper foil for a printed wiring board by supplying current between a rotary cathode and an electrolytic anode in a copper electrolyte so as to electrodeposit copper on the surface of the rotary cathode, wherein an anode for high electric current is placed opposite to the electrodeposition starting surface of the rotary cathode in such a manner that a part of the anode is projected above a liquid level of the copper electrolyte, and the copper electrolyte existing between the anode for high electric current and the opposed rotary cathode surface is electrolyzed by providing a high electric current with a current density higher than that of the electrolytic anode, and an apparatus for producing an electrolytic copper foil for a printed wiring board having excellent properties.

Abstract: A process for preparing said multilayer printed wiring board comprising the steps of (1) adhering copper foils respectively to both the faces of a substrate, masking and etching said foils in a usual way to form circuits, (2) applying copper foils having a semi-cured insulating layer formed on one face thereof respectively to said circuits with the insulating layer facing to said circuit, the insulating layers being as defined above, and then pressing the whole together under heat and (3) masking and etching the copper foils with the insulating layer thereon in a usual way to form circuits, the steps (2) and (3) being repeated as many times as desired.

Abstract: An adhesive for copper foils which comprises 40-70% by weight of an epoxy resin, 20-50% by weight of a polyvinyl acetal resin and 0.1-20% weight of a melamine or urethane resin, all of said resins totalling 100% by weight, with the proviso that 5-80% by weight of said epoxy resin is a rubber-modified epoxy resin; andAn adhesive-applied copper foil having said adhesive attached onto its one face.

Abstract: A printed circuit inner-layer copper foil having inverted tear drop-shaped fine nodules formed on both surfaces of a copper foil each having surface roughness Rz=1 to 3 .mu.m, the nodules having a length of 0.6 to 1.0 .mu.m and a maximum diameter of 0.2 to 0.8 .mu.m, and a process for producing said inner-layer copper foil.