Patents by Inventor Munehiko Nakatsuma

Munehiko Nakatsuma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flux, solder composition, and method for manufacturing electronic circuit mounted substrate
    Patent number: 9609762
    Abstract: Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: March 28, 2017
    Assignee: KOKI Company Limited
    Inventors: Kenji Arai, Mitsuyasu Furusawa, Junichi Aoki, Mayumi Takada, Munehiko Nakatsuma
  • Flux, Solder Composition, and Method for Manufacturing Electronic Circuit Mounted Substrate
    Publication number: 20150102090
    Abstract: Provided is a flux that includes at least one polybutadiene (meth)acrylate compound selected from polybutadiene (meth)acrylate compounds and polybutadiene (meth)acrylate compounds, and a hydrogenated dimer acid.
    Type: Application
    Filed: March 11, 2013
    Publication date: April 16, 2015
    Inventors: Kenji Arai, Mitsuyasu Furusawa, Junichi Aoki, Mayumi Takada, Munehiko Nakatsuma