Patents by Inventor Munehisa YAMAKOSHI

Munehisa YAMAKOSHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Diffusion bonding heat exchanger
    Patent number: 11768037
    Abstract: A diffusion bonding heat exchanger includes a first heat transfer plate and a second heat transfer plate. A high-temperature flow path of the first heat transfer plate includes a connection channel portion configured such that a high-temperature fluid can flow across a plurality of channels within at least a range that overlaps a predetermined range in a stacking direction, the predetermined range being a range from a flow path inlet of the second heat transfer plate to a position downstream of the flow path inlet.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: September 26, 2023
    Assignee: Sumitomo Precision Products Co., Ltd.
    Inventors: Munehisa Yamakoshi, Yasuhiro Fujita, Eiji Togo, Suguru Takahashi
  • Diffusion Bonding Heat Exchanger
    Publication number: 20210116182
    Abstract: A diffusion bonding heat exchanger includes a first heat transfer plate and a second heat transfer plate. A high-temperature flow path of the first heat transfer plate includes a connection channel portion configured such that a high-temperature fluid can flow across a plurality of channels within at least a range that overlaps a predetermined range in a stacking direction, the predetermined range being a range from a flow path inlet of the second heat transfer plate to a position downstream of the flow path inlet.
    Type: Application
    Filed: March 25, 2019
    Publication date: April 22, 2021
    Inventors: Munehisa YAMAKOSHI, Yasuhiro FUJITA, Eiji TOGO, Suguru TAKAHASHI